We propose a novel antenna design enabled by 3-D printing technology for future wireless intrachip interconnects aiming at applications of multicore architectures and system-on-chips. In our proposed design we use vertical quarter-wavelength monopoles at 160 GHz on a ground plane to avoid low antenna radiation efficiency caused by the silicon substrate. The monopoles are surrounded by a specially designed dielectric property distribution. This additional degree of freedom in design enabled by 3-D printing technology is used to tailor the electromagnetic wave propagation. As a result, the desired wireless link gain is enhanced and the undesired spatial crosstalk is reduced. Simulation results show that the proposed dielectric loading approach improves the desired link gain by 8-15 dB and reduces the crosstalk by 9-23 dB from 155 to 165 GHz. As a proof-of-concept, a 60 GHz prototype is designed, fabricated, and characterized. Our measurement results match the simulation results and demonstrate 10-18 dB improvement of the desired link gain and 10-30 dB reduction in the crosstalk from 55 to 61 GHz. The demonstrated transmission loss of the desired link at a distance of 17 mm is only 15 dB, which is over 10 dB better than the previously reported work.
- 3-D printing
- electromagnetic propagation
- intrachip communication
- multiprocessor interconnection
- network-on-chip (NoC)
ASJC Scopus subject areas
- Electrical and Electronic Engineering