Monopoles Loaded with 3-D-Printed Dielectrics for Future Wireless Intra-Chip Communications

Junqiang Wu, Avinash Kodi, Savas Kaya, Ahmed Louri, Hao Xin

Research output: Research - peer-reviewArticle

Abstract

We propose a novel antenna design enabled by 3-D printing technology for future wireless intra-chip interconnects aiming at applications of multicore architectures and system-on-chips (SoCs). In our proposed design we use vertical quarter-wavelength monopoles at 160 GHz on a ground plane to avoid low antenna radiation efficiency caused by the silicon substrate. The monopoles are surrounded by a specially-designed dielectric property distribution. This additional degree of freedom in design enabled by 3-D printing technology is used to tailor the electromagnetic wave propagation. As a result, the desired wireless link gain is enhanced and the undesired spatial crosstalk is reduced. Simulation results show that the proposed dielectric loading approach improves the desired link gain by 8-15 dB and reduces the crosstalk by 9-23 dB from 155 GHz to 165 GHz. As a proof-of-concept, a 60 GHz prototype is designed, fabricated and characterized. Our measurement results match the simulation results and demonstrate 10-18 dB improvement of the desired link gain and 10-30 dB reduction in the crosstalk from 55 GHz to 61 GHz. The demonstrated transmission loss of the desired link at a distance of 17 mm is only 15 dB, which is over 10 dB better than the previously reported work.

LanguageEnglish (US)
JournalIEEE Transactions on Antennas and Propagation
DOIs
StateAccepted/In press - Oct 1 2017

Fingerprint

Crosstalk
Communication
Printing
Antenna radiation
Electromagnetic wave propagation
Antenna grounds
Dielectric properties
Telecommunication links
Antennas
Silicon
Wavelength
Substrates
Wireless interconnects
System-on-chip

Keywords

  • 3-D printing
  • Antennas
  • antennas
  • Computer architecture
  • Dielectrics
  • electromagnetic propagation
  • Gain
  • interconnect
  • intra-chip communication
  • multiprocessor interconnection
  • network on chip
  • Silicon
  • Substrates
  • Wireless communication

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Monopoles Loaded with 3-D-Printed Dielectrics for Future Wireless Intra-Chip Communications. / Wu, Junqiang; Kodi, Avinash; Kaya, Savas; Louri, Ahmed; Xin, Hao.

In: IEEE Transactions on Antennas and Propagation, 01.10.2017.

Research output: Research - peer-reviewArticle

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