Nanophotonic Interconnects and 3-D Stacked Technology for Future Many-Core Architectures

Xiang Zhang, Ahmed Louri

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We explore silicon photonics and 3-D stacked technology to implement a photonic network-on-chips. The proposed scheme provides 2.56 Tb/sec bandwidth with a much reduced power consumption and latency compared to any leading on-chip photonic networks.

Original languageEnglish (US)
Title of host publicationFrontiers in Optics, FiO 2009
PublisherOptical Society of America
ISBN (Print)9781557528780
StatePublished - Jan 1 2009
EventFrontiers in Optics, FiO 2009 - San Jose, CA, United States
Duration: Oct 11 2009Oct 15 2009

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701

Other

OtherFrontiers in Optics, FiO 2009
CountryUnited States
CitySan Jose, CA
Period10/11/0910/15/09

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ASJC Scopus subject areas

  • Instrumentation
  • Atomic and Molecular Physics, and Optics

Cite this

Zhang, X., & Louri, A. (2009). Nanophotonic Interconnects and 3-D Stacked Technology for Future Many-Core Architectures. In Frontiers in Optics, FiO 2009 (Optics InfoBase Conference Papers). Optical Society of America.