A diversity of advanced modeling and simulation tools for application to packaging and interconnect problems have been developed over the past decade. The development of accurate mixed signal and high frequency models requires verification and validation using high frequency measurements. The need for model verification requires accurate measurement calibration for good comparison data. This work compares a variety of calibration methods for use with on-wafer probing and assesses their various advantages and limitations.
|Original language||English (US)|
|Number of pages||7|
|Journal||Proceedings - Electronic Components and Technology Conference|
|State||Published - Jan 1 2000|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering