New approach for pre-polish grinding with low subsurface damage

James B. Johnson, Dae Wook Kim, Robert E. Parks, James H. Burge

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Scopus citations

Abstract

For an optical surface to be properly prepared, the amount of material removed during polishing must be greater than the volume of grinding damage. An intermediate stage between loose abrasive grinding and polishing can reduce the total volume of subsurface damage. This results in less time and expense needed during the polishing phase. We have characterized the Prestos's coefficient and subsurface damage depth for 3M TrizactTM diamond tile pads and believe it can fit this intermediary role. Trizact shows a sizeable reduction in the overall subsurface damage compared to similar sized loose abrasives. This understanding of the abrasive behavior allows us to create a better grinding schedule that more efficiently removes material and finishing with less overall damage than traditional loose abrasives.

Original languageEnglish (US)
Title of host publicationOptical Manufacturing and Testing IX
DOIs
StatePublished - 2011
EventOptical Manufacturing and Testing IX - San Diego, CA, United States
Duration: Aug 22 2011Aug 24 2011

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8126
ISSN (Print)0277-786X

Other

OtherOptical Manufacturing and Testing IX
CountryUnited States
CitySan Diego, CA
Period8/22/118/24/11

Keywords

  • Optical fabrication
  • Stress lap
  • Subsurface damage
  • Taper polish
  • Trizact

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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