New approach for pre-polish grinding with low subsurface damage

James B. Johnson, Dae Wook Kim, Robert E. Parks, James H Burge

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

For an optical surface to be properly prepared, the amount of material removed during polishing must be greater than the volume of grinding damage. An intermediate stage between loose abrasive grinding and polishing can reduce the total volume of subsurface damage. This results in less time and expense needed during the polishing phase. We have characterized the Prestos's coefficient and subsurface damage depth for 3M TrizactTM diamond tile pads and believe it can fit this intermediary role. Trizact shows a sizeable reduction in the overall subsurface damage compared to similar sized loose abrasives. This understanding of the abrasive behavior allows us to create a better grinding schedule that more efficiently removes material and finishing with less overall damage than traditional loose abrasives.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Volume8126
DOIs
StatePublished - 2011
EventOptical Manufacturing and Testing IX - San Diego, CA, United States
Duration: Aug 22 2011Aug 24 2011

Other

OtherOptical Manufacturing and Testing IX
CountryUnited States
CitySan Diego, CA
Period8/22/118/24/11

Fingerprint

Subsurface Damage
Industrial Oils
Polishing
Grinding
grinding
Abrasives
abrasives
damage
polishing
Damage
Diamond
Tile
Strombus or kite or diamond
Diamonds
Schedule
tiles
schedules
Coefficient
diamonds
coefficients

Keywords

  • Optical fabrication
  • Stress lap
  • Subsurface damage
  • Taper polish
  • Trizact

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Johnson, J. B., Kim, D. W., Parks, R. E., & Burge, J. H. (2011). New approach for pre-polish grinding with low subsurface damage. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 8126). [81261E] https://doi.org/10.1117/12.893912

New approach for pre-polish grinding with low subsurface damage. / Johnson, James B.; Kim, Dae Wook; Parks, Robert E.; Burge, James H.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 8126 2011. 81261E.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Johnson, JB, Kim, DW, Parks, RE & Burge, JH 2011, New approach for pre-polish grinding with low subsurface damage. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 8126, 81261E, Optical Manufacturing and Testing IX, San Diego, CA, United States, 8/22/11. https://doi.org/10.1117/12.893912
Johnson JB, Kim DW, Parks RE, Burge JH. New approach for pre-polish grinding with low subsurface damage. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 8126. 2011. 81261E https://doi.org/10.1117/12.893912
Johnson, James B. ; Kim, Dae Wook ; Parks, Robert E. ; Burge, James H. / New approach for pre-polish grinding with low subsurface damage. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 8126 2011.
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