Nonorthogonal wafer dicing for waveguide, microelectromechanical systems, and nanotechnology applications

S. Pau, J. A. Taylor, C. S. Pai

Research output: Contribution to journalArticle

2 Scopus citations

Abstract

A technique to dice wafer was analyzed by using photolithography and reactive ion etching. The photoresists were used as a mask to protect the underlying device during the etching. It was observed that typical wafer cutting required a spacing of the order of about 100 μm. It was also observed that this technique could be used to cut very small die with almost any conceivable shape subject to the limitations of dry etching.

Original languageEnglish (US)
Pages (from-to)L15-L16
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume22
Issue number4
DOIs
StatePublished - Jul 1 2004
Externally publishedYes

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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