Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect

Junqiang Wu, Hao Xin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

A novel antenna design that is enabled by 3D printing technology for future wireless intra-chip communications is proposed in this work. Vertical quarter-wavelength monopoles are used for intra-chip communication, which avoids substrate-caused low antenna radiation efficiency. The monopoles are surrounded by specially-designed dielectric distribution. This additional design degree of freedom allowed by 3D printing technology is used to tailor antenna radiation pattern that enhances the desired link and reduces the undesired crosstalk spatially. A 60 GHz prototype is designed, fabricated and measured. The measurement results agree well with the simulation results. The demonstrated path loss of the desired link at a distance of 17 mm is only 12 dB, which is more than 10 dB better than the theoretical value for 60 GHz monopoles based on Friis transmission equation and previously reported work.

Original languageEnglish (US)
Title of host publication2017 IEEE Antennas and Propagation Society International Symposium, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1237-1238
Number of pages2
Volume2017-January
ISBN (Electronic)9781538632840
DOIs
StatePublished - Oct 18 2017
Event2017 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, APSURSI 2017 - San Diego, United States
Duration: Jul 9 2017Jul 14 2017

Other

Other2017 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, APSURSI 2017
CountryUnited States
CitySan Diego
Period7/9/177/14/17

Keywords

  • 3D printing
  • Interconnect
  • Intra-chip communication
  • Monopole
  • Multiprocessor interconnection
  • Network on chip

ASJC Scopus subject areas

  • Radiation
  • Computer Networks and Communications
  • Instrumentation

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  • Cite this

    Wu, J., & Xin, H. (2017). Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect. In 2017 IEEE Antennas and Propagation Society International Symposium, Proceedings (Vol. 2017-January, pp. 1237-1238). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APUSNCURSINRSM.2017.8072661