Novel end-point detection method by monitoring shear force oscillation frequency for barrier metal polishing in advanced LSI

Xun Gu, Takenao Nemoto, Yasa Sampurno, Jiang Cheng, Sian Nie Theng, Ara Philipossian, Yun Zhuang, Akinobu Teramoto, Takashi Ito, Shigetoshi Sugawa, Tadahiro Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A novel end-point detection method based on a combination of shear force and its spectral amplitude was proposed for barrier metal polishing on copper damascene structures. Under some polishing conditions, the shear force changed significantly with polished substrate. On the other hand, the change in shear force was insignificant under certain polishing conditions. Therefore, a complementary end-point detection method by monitoring oscillation frequency of shear force was proposed. It was found that the shear force fluctuated in unique frequencies depending on polished substrates. Using Fast Fourier Transformation, the shear force data was converted from time domain to frequency domain. The amplitude of spectral frequencies corresponding to the rotational rate of wafer carrier and platen was monitored. Significant frequency amplitude changes were observed before, during and after the polished layer transition from barrier film to silicon dioxide film. The results indicated that a combination of shear force and its spectral amplitude analyses provided effective end-point detection for barrier CMP process.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium Proceedings
Pages157-162
Number of pages6
Volume1157
StatePublished - 2010
Event2009 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 14 2009Apr 17 2009

Other

Other2009 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period4/14/094/17/09

Fingerprint

metal polishing
large scale integration
Polishing
Metals
shear
oscillations
Monitoring
Cytidine Monophosphate
Substrates
Silicon Dioxide
Copper
polishing
Silica
platens
transition layers
fast Fourier transformations
wafers
silicon dioxide
copper

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Gu, X., Nemoto, T., Sampurno, Y., Cheng, J., Theng, S. N., Philipossian, A., ... Ohmi, T. (2010). Novel end-point detection method by monitoring shear force oscillation frequency for barrier metal polishing in advanced LSI. In Materials Research Society Symposium Proceedings (Vol. 1157, pp. 157-162)

Novel end-point detection method by monitoring shear force oscillation frequency for barrier metal polishing in advanced LSI. / Gu, Xun; Nemoto, Takenao; Sampurno, Yasa; Cheng, Jiang; Theng, Sian Nie; Philipossian, Ara; Zhuang, Yun; Teramoto, Akinobu; Ito, Takashi; Sugawa, Shigetoshi; Ohmi, Tadahiro.

Materials Research Society Symposium Proceedings. Vol. 1157 2010. p. 157-162.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gu, X, Nemoto, T, Sampurno, Y, Cheng, J, Theng, SN, Philipossian, A, Zhuang, Y, Teramoto, A, Ito, T, Sugawa, S & Ohmi, T 2010, Novel end-point detection method by monitoring shear force oscillation frequency for barrier metal polishing in advanced LSI. in Materials Research Society Symposium Proceedings. vol. 1157, pp. 157-162, 2009 MRS Spring Meeting, San Francisco, CA, United States, 4/14/09.
Gu X, Nemoto T, Sampurno Y, Cheng J, Theng SN, Philipossian A et al. Novel end-point detection method by monitoring shear force oscillation frequency for barrier metal polishing in advanced LSI. In Materials Research Society Symposium Proceedings. Vol. 1157. 2010. p. 157-162
Gu, Xun ; Nemoto, Takenao ; Sampurno, Yasa ; Cheng, Jiang ; Theng, Sian Nie ; Philipossian, Ara ; Zhuang, Yun ; Teramoto, Akinobu ; Ito, Takashi ; Sugawa, Shigetoshi ; Ohmi, Tadahiro. / Novel end-point detection method by monitoring shear force oscillation frequency for barrier metal polishing in advanced LSI. Materials Research Society Symposium Proceedings. Vol. 1157 2010. pp. 157-162
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abstract = "A novel end-point detection method based on a combination of shear force and its spectral amplitude was proposed for barrier metal polishing on copper damascene structures. Under some polishing conditions, the shear force changed significantly with polished substrate. On the other hand, the change in shear force was insignificant under certain polishing conditions. Therefore, a complementary end-point detection method by monitoring oscillation frequency of shear force was proposed. It was found that the shear force fluctuated in unique frequencies depending on polished substrates. Using Fast Fourier Transformation, the shear force data was converted from time domain to frequency domain. The amplitude of spectral frequencies corresponding to the rotational rate of wafer carrier and platen was monitored. Significant frequency amplitude changes were observed before, during and after the polished layer transition from barrier film to silicon dioxide film. The results indicated that a combination of shear force and its spectral amplitude analyses provided effective end-point detection for barrier CMP process.",
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AU - Philipossian, Ara

AU - Zhuang, Yun

AU - Teramoto, Akinobu

AU - Ito, Takashi

AU - Sugawa, Shigetoshi

AU - Ohmi, Tadahiro

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