Novel slurry injection system for improved slurry flow and reduced defects in CMP

Ara Philipossian, Len Borucki, Yasa Sampurno, Yun Zhuang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations
Original languageEnglish (US)
Title of host publicationUltra Clean Processing of Semiconductor Surfaces XII
EditorsMarc Heyns, Marc Meuris, Paul W. Mertens, Marc Meuris, Marc Heyns
PublisherTrans Tech Publications Ltd
Pages143-147
Number of pages5
ISBN (Electronic)9783038352426
DOIs
StatePublished - Jan 1 2015
Event12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2014 - Brussels, Belgium
Duration: Sep 21 2014Sep 24 2014

Publication series

NameSolid State Phenomena
Volume219
ISSN (Electronic)1662-9779

Other

Other12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2014
CountryBelgium
CityBrussels
Period9/21/149/24/14

Keywords

  • CMP
  • COO
  • Foam
  • Pad debris
  • Slurry flow
  • Slurry injection system
  • Wafer-level defects

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Philipossian, A., Borucki, L., Sampurno, Y., & Zhuang, Y. (2015). Novel slurry injection system for improved slurry flow and reduced defects in CMP. In M. Heyns, M. Meuris, P. W. Mertens, M. Meuris, & M. Heyns (Eds.), Ultra Clean Processing of Semiconductor Surfaces XII (pp. 143-147). (Solid State Phenomena; Vol. 219). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/SSP.219.143