Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

Yun Zhuang, Yasa Sampurno, Leonard Borucki, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, a novel slurry injection system (SIS) is introduced. SIS is placed on top of the pad which conformally rides on the pad surface during polishing and presents a thin and uniform slurry film to the wafer. Examples of SIS installed on various 200 and 300 mm commercial polishers are shown. Removal rate and polishing defects are compared between SIS and the conventional pad center area slurry application method. Through more efficient slurry delivery and reduced slurry mixing and dilution, SIS has achieved more uniform slurry flow, higher material removal rate or the same removal rate with significantly lower slurry consumption, and lower number of wafer-level polishing defects than the conventional slurry application method.

Original languageEnglish (US)
Title of host publicationICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages45-49
Number of pages5
ISBN (Print)9781479955565
DOIs
StatePublished - Jan 20 2015
Externally publishedYes
Event11th International Conference on Planarization/CMP Technology, ICPT 2014 - Kobe, Japan
Duration: Nov 19 2014Nov 21 2014

Other

Other11th International Conference on Planarization/CMP Technology, ICPT 2014
CountryJapan
CityKobe
Period11/19/1411/21/14

Fingerprint

Polishing
Defects
Dilution

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Zhuang, Y., Sampurno, Y., Borucki, L., & Philipossian, A. (2015). Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014 (pp. 45-49). [7017242] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICPT.2014.7017242

Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP. / Zhuang, Yun; Sampurno, Yasa; Borucki, Leonard; Philipossian, Ara.

ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc., 2015. p. 45-49 7017242.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhuang, Y, Sampurno, Y, Borucki, L & Philipossian, A 2015, Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP. in ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014., 7017242, Institute of Electrical and Electronics Engineers Inc., pp. 45-49, 11th International Conference on Planarization/CMP Technology, ICPT 2014, Kobe, Japan, 11/19/14. https://doi.org/10.1109/ICPT.2014.7017242
Zhuang Y, Sampurno Y, Borucki L, Philipossian A. Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc. 2015. p. 45-49. 7017242 https://doi.org/10.1109/ICPT.2014.7017242
Zhuang, Yun ; Sampurno, Yasa ; Borucki, Leonard ; Philipossian, Ara. / Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP. ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 45-49
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