Novel slurry injector device for chemical mechanical planarization

Anand Meled, Leonard Borucki, Yasa Sampurno, Yun Zhuang, Sian Theng, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes a novel slurry injector device for chemical mechanical planarization (CMP). The device exhibits superior properties compared to the standard pad center injection method as evidenced by: (1) improved slurry utilization, (2) minimal mixing of fresh slurry with water or old slurry, (3) higher removal rate at a given slurry flow rate, (4) same removal rate with significantly lower slurry consumption and (5) lower wafer-level defects.

Original languageEnglish (US)
Title of host publicationAdvanced Metallization Conference (AMC)
Pages156-157
Number of pages2
StatePublished - 2010
EventAdvanced Metallization Conference 2010 - Albany, NY, United States
Duration: Oct 5 2010Oct 7 2010

Other

OtherAdvanced Metallization Conference 2010
CountryUnited States
CityAlbany, NY
Period10/5/1010/7/10

Fingerprint

Chemical mechanical polishing
Flow rate
Defects
Water

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

Cite this

Meled, A., Borucki, L., Sampurno, Y., Zhuang, Y., Theng, S., & Philipossian, A. (2010). Novel slurry injector device for chemical mechanical planarization. In Advanced Metallization Conference (AMC) (pp. 156-157)

Novel slurry injector device for chemical mechanical planarization. / Meled, Anand; Borucki, Leonard; Sampurno, Yasa; Zhuang, Yun; Theng, Sian; Philipossian, Ara.

Advanced Metallization Conference (AMC). 2010. p. 156-157.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Meled, A, Borucki, L, Sampurno, Y, Zhuang, Y, Theng, S & Philipossian, A 2010, Novel slurry injector device for chemical mechanical planarization. in Advanced Metallization Conference (AMC). pp. 156-157, Advanced Metallization Conference 2010, Albany, NY, United States, 10/5/10.
Meled A, Borucki L, Sampurno Y, Zhuang Y, Theng S, Philipossian A. Novel slurry injector device for chemical mechanical planarization. In Advanced Metallization Conference (AMC). 2010. p. 156-157
Meled, Anand ; Borucki, Leonard ; Sampurno, Yasa ; Zhuang, Yun ; Theng, Sian ; Philipossian, Ara. / Novel slurry injector device for chemical mechanical planarization. Advanced Metallization Conference (AMC). 2010. pp. 156-157
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