Novel slurry injector device for chemical mechanical planarization

Anand Meled, Leonard Borucki, Yasa Sampurno, Yun Zhuang, Sian Theng, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes a novel slurry injector device for chemical mechanical planarization (CMP). The device exhibits superior properties compared to the standard pad center injection method as evidenced by: (1) improved slurry utilization, (2) minimal mixing of fresh slurry with water or old slurry, (3) higher removal rate at a given slurry flow rate, (4) same removal rate with significantly lower slurry consumption and (5) lower wafer-level defects.

Original languageEnglish (US)
Title of host publicationAdvanced Metallization Conference 2010
Pages156-157
Number of pages2
StatePublished - Dec 1 2010
EventAdvanced Metallization Conference 2010 - Albany, NY, United States
Duration: Oct 5 2010Oct 7 2010

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766

Other

OtherAdvanced Metallization Conference 2010
CountryUnited States
CityAlbany, NY
Period10/5/1010/7/10

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ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

Cite this

Meled, A., Borucki, L., Sampurno, Y., Zhuang, Y., Theng, S., & Philipossian, A. (2010). Novel slurry injector device for chemical mechanical planarization. In Advanced Metallization Conference 2010 (pp. 156-157). (Advanced Metallization Conference (AMC)).