Numerical solution of conjugate heat transfer in convective cooling of electronics using the boundary element method

Humayun Kabir, Shankar Ramanathan, Alfonso Ortega, Cho Lik Chan

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

A formulation of the conjugate heat transfer in convective cooling of electronics is presented using the boundary element method. A general formulation for combining the fluid convection region and the solid conduction region is presented. The effects of upstream conduction on the component heat transfer, and the effects of substrate conductivity on the downstream thermal wake are presented. The fundamental issue of matching different equation types, elliptic in the solid, and parabolic in the fluid, is also briefly discussed.

Original languageEnglish (US)
Pages (from-to)31-39
Number of pages9
JournalAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume299
StatePublished - Dec 1 1994
EventProceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA
Duration: Nov 6 1994Nov 11 1994

ASJC Scopus subject areas

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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