Numerical solution of conjugate heat transfer in convective cooling of electronics using the boundary element method

Humayun Kabir, Shankar Ramanathan, Alfonso Ortega, Cholik Chan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A formulation of the conjugate heat transfer in convective cooling of electronics is presented using the boundary element method. A general formulation for combining the fluid convection region and the solid conduction region is presented. The effects of upstream conduction on the component heat transfer, and the effects of substrate conductivity on the downstream thermal wake are presented. The fundamental issue of matching different equation types, elliptic in the solid, and parabolic in the fluid, is also briefly discussed.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
PublisherASME
Pages31-39
Number of pages9
Volume299
StatePublished - 1994
EventProceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA
Duration: Nov 6 1994Nov 11 1994

Other

OtherProceedings of the 1994 International Mechanical Engineering Congress and Exposition
CityChicago, IL, USA
Period11/6/9411/11/94

Fingerprint

Boundary element method
Electronic equipment
Heat transfer
Cooling
Fluids
Substrates
Hot Temperature
Convection

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

Cite this

Kabir, H., Ramanathan, S., Ortega, A., & Chan, C. (1994). Numerical solution of conjugate heat transfer in convective cooling of electronics using the boundary element method. In American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD (Vol. 299, pp. 31-39). ASME.

Numerical solution of conjugate heat transfer in convective cooling of electronics using the boundary element method. / Kabir, Humayun; Ramanathan, Shankar; Ortega, Alfonso; Chan, Cholik.

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. Vol. 299 ASME, 1994. p. 31-39.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kabir, H, Ramanathan, S, Ortega, A & Chan, C 1994, Numerical solution of conjugate heat transfer in convective cooling of electronics using the boundary element method. in American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. vol. 299, ASME, pp. 31-39, Proceedings of the 1994 International Mechanical Engineering Congress and Exposition, Chicago, IL, USA, 11/6/94.
Kabir H, Ramanathan S, Ortega A, Chan C. Numerical solution of conjugate heat transfer in convective cooling of electronics using the boundary element method. In American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. Vol. 299. ASME. 1994. p. 31-39
Kabir, Humayun ; Ramanathan, Shankar ; Ortega, Alfonso ; Chan, Cholik. / Numerical solution of conjugate heat transfer in convective cooling of electronics using the boundary element method. American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. Vol. 299 ASME, 1994. pp. 31-39
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