On-wafer measurement of microstrip-based circuits with a broadband vialess transition

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

A broadband vialess coplanar waveguide (CPW)-to-microstrip transition for on-wafer measurements has been developed. The electrical connection between the top ground of the CPW and the bottom ground of the microstrip is realized by electromagnetic coupling, thus no substrate via holes are required. In this paper, simulation and measurement results of the transition are given, the optimal design rules are discussed, and the utilization of the transition for de-embedding microstrip benchmark structures is presented. The measured insertion loss of two transitions in a back-to-back configuration is less than 0.5 dB from 2.5 to 11.8 GHz, and the measured return loss is better than 20 dB from 3 to 11 GHz.

Original languageEnglish (US)
Pages (from-to)654-659
Number of pages6
JournalIEEE Transactions on Advanced Packaging
Volume29
Issue number3
DOIs
StatePublished - Aug 2006

Fingerprint

Antenna grounds
Coplanar waveguides
Waveguide couplers
Electromagnetic coupling
Networks (circuits)
Insertion losses
Substrates
Optimal design

Keywords

  • Coplanar waveguide (CPW)-to-microstrip transition
  • Microstrip on-wafer measurement
  • Multiline thru-reflect-line (ML-TRL) calibration
  • Vialess

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

On-wafer measurement of microstrip-based circuits with a broadband vialess transition. / Zhu, Lin; Melde, Kathleen L.

In: IEEE Transactions on Advanced Packaging, Vol. 29, No. 3, 08.2006, p. 654-659.

Research output: Contribution to journalArticle

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