Opportunities and challenges in electrochemical-mechanical planarization (ECMP)

A. Muthukumaran, N. Venkataraman, Srini Raghavan, Manish K Keswani

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electrochemical-mechanical planarization is challenging conventional CMP for use in the planarization of certain metallic films, especially copper. Because of the complex interplay between electrochemical and mechanical factors, and the evolution of newer metals such as ruthenium as barrier materials, the ECMP field is wide open for research in the area of consumables. In this paper, recent work in the area of ECMP of copper and tantalum is reviewed, with special reference to chemical formulations. Opportunities in ECMP of ruthenium are highlighted through a discussion of its chemistry and electrochemistry.

Original languageEnglish (US)
Title of host publicationProceedings - Electrochemical Society
Pages511-517
Number of pages7
VolumePV 2008-1
StatePublished - 2008
Event7th International Conference on Semiconductor Technology, ISTC 2008 - Shanghai, China
Duration: Mar 15 2008Mar 17 2008

Other

Other7th International Conference on Semiconductor Technology, ISTC 2008
CountryChina
CityShanghai
Period3/15/083/17/08

Fingerprint

Ruthenium
Copper
Tantalum
Cytidine Monophosphate
Metallic films
Electrochemistry
Metals

Keywords

  • Copper
  • Electrochemical-mechanical planarization
  • Ruthenium
  • Tantalum

ASJC Scopus subject areas

  • Electrochemistry

Cite this

Muthukumaran, A., Venkataraman, N., Raghavan, S., & Keswani, M. K. (2008). Opportunities and challenges in electrochemical-mechanical planarization (ECMP). In Proceedings - Electrochemical Society (Vol. PV 2008-1, pp. 511-517)

Opportunities and challenges in electrochemical-mechanical planarization (ECMP). / Muthukumaran, A.; Venkataraman, N.; Raghavan, Srini; Keswani, Manish K.

Proceedings - Electrochemical Society. Vol. PV 2008-1 2008. p. 511-517.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Muthukumaran, A, Venkataraman, N, Raghavan, S & Keswani, MK 2008, Opportunities and challenges in electrochemical-mechanical planarization (ECMP). in Proceedings - Electrochemical Society. vol. PV 2008-1, pp. 511-517, 7th International Conference on Semiconductor Technology, ISTC 2008, Shanghai, China, 3/15/08.
Muthukumaran A, Venkataraman N, Raghavan S, Keswani MK. Opportunities and challenges in electrochemical-mechanical planarization (ECMP). In Proceedings - Electrochemical Society. Vol. PV 2008-1. 2008. p. 511-517
Muthukumaran, A. ; Venkataraman, N. ; Raghavan, Srini ; Keswani, Manish K. / Opportunities and challenges in electrochemical-mechanical planarization (ECMP). Proceedings - Electrochemical Society. Vol. PV 2008-1 2008. pp. 511-517
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