Optical Multilevel Signaling for High Bandwidth and Power-Efficient On-Chip Interconnects

Tzyy Juin Kao, Ahmed Louri

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The scalability of high-performance computing systems is increasingly dependent on high-bandwidth and power-efficient communication between a growing number of processing cores on-and off-chip. Recent developments in silicon photonics technology can potentially alleviate many of the challenges associated with these stringent interconnection demands. In this letter, we propose the use of an optical multilevel signaling technique for on-chip interconnects in conjunction with wavelength division multiplexing to double the aggregate communication bandwidth without increasing the number of waveguides and wavelengths used, thereby reducing scaling costs.

Original languageEnglish (US)
Article number7134732
Pages (from-to)2051-2054
Number of pages4
JournalIEEE Photonics Technology Letters
Volume27
Issue number19
DOIs
StatePublished - Oct 1 2015

Fingerprint

communication
chips
bandwidth
Bandwidth
Communication
Silicon
wavelength division multiplexing
Wavelength division multiplexing
Photonics
Scalability
Waveguides
photonics
waveguides
costs
scaling
Wavelength
silicon
Processing
wavelengths
Costs

Keywords

  • amplitude shift keying
  • Optical interconnections
  • photonic integrated circuits

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials

Cite this

Optical Multilevel Signaling for High Bandwidth and Power-Efficient On-Chip Interconnects. / Kao, Tzyy Juin; Louri, Ahmed.

In: IEEE Photonics Technology Letters, Vol. 27, No. 19, 7134732, 01.10.2015, p. 2051-2054.

Research output: Contribution to journalArticle

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