### Abstract

The effect of polisher kinematics on average and standard deviation of shear force and removal rate in copper CMP is investigated. A 'delamination factor' consisting of average shear force, standard deviation of shear force, and required polishing time is defined and calculated based on the summation of normalized values of the above three components. In general, low values of the 'delamination factor' are preferred since it is believed that they minimize defects during polishing. In the first part of this study, 200-mm blanket copper wafers are polished at constant platen rotation of 25 RPM and polishing pressure of 1.5 PSI with different wafer rotation rates and slurry flow rates. Results indicate that at the slurry flow rate of 200 ml/min, 'delamination factor' is lower by 14 to 54 percent than at 400 ml/min. Increasing wafer rotation rate from 23 to 148 RPM reduces 'delamination factor' by approximately 50 percent and improves removal rate within-wafer-non-uniformity by appx. 2X. In the second part of this study, polishing is performed at the optimal slurry flow rate of 200 ml/min and wafer rotation rate of 148 RPM with different polishing pressures and platen rotation rates. Results indicate that 'delamination factor' is reduced significantly at the higher ratio of wafer to platen rotation rates.

Original language | English (US) |
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Title of host publication | Materials Research Society Symposium Proceedings |

Pages | 3-8 |

Number of pages | 6 |

Volume | 1157 |

State | Published - 2010 |

Event | 2009 MRS Spring Meeting - San Francisco, CA, United States Duration: Apr 14 2009 → Apr 17 2009 |

### Other

Other | 2009 MRS Spring Meeting |
---|---|

Country | United States |

City | San Francisco, CA |

Period | 4/14/09 → 4/17/09 |

### Fingerprint

### ASJC Scopus subject areas

- Materials Science(all)
- Condensed Matter Physics
- Mechanical Engineering
- Mechanics of Materials

### Cite this

*Materials Research Society Symposium Proceedings*(Vol. 1157, pp. 3-8)

**Optimizing pad groove design and polishing kinematics for reduced shear force, low force fluctuation and optimum removal rate attributes of copper CMP.** / Sampurno, Yasa; Philipossian, Ara; Theng, Sian; Nemoto, Takenao; Gu, Xun; Zhuang, Yun; Teramoto, Akinobu; Ohmi, Tadahiro.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

*Materials Research Society Symposium Proceedings.*vol. 1157, pp. 3-8, 2009 MRS Spring Meeting, San Francisco, CA, United States, 4/14/09.

}

TY - GEN

T1 - Optimizing pad groove design and polishing kinematics for reduced shear force, low force fluctuation and optimum removal rate attributes of copper CMP

AU - Sampurno, Yasa

AU - Philipossian, Ara

AU - Theng, Sian

AU - Nemoto, Takenao

AU - Gu, Xun

AU - Zhuang, Yun

AU - Teramoto, Akinobu

AU - Ohmi, Tadahiro

PY - 2010

Y1 - 2010

N2 - The effect of polisher kinematics on average and standard deviation of shear force and removal rate in copper CMP is investigated. A 'delamination factor' consisting of average shear force, standard deviation of shear force, and required polishing time is defined and calculated based on the summation of normalized values of the above three components. In general, low values of the 'delamination factor' are preferred since it is believed that they minimize defects during polishing. In the first part of this study, 200-mm blanket copper wafers are polished at constant platen rotation of 25 RPM and polishing pressure of 1.5 PSI with different wafer rotation rates and slurry flow rates. Results indicate that at the slurry flow rate of 200 ml/min, 'delamination factor' is lower by 14 to 54 percent than at 400 ml/min. Increasing wafer rotation rate from 23 to 148 RPM reduces 'delamination factor' by approximately 50 percent and improves removal rate within-wafer-non-uniformity by appx. 2X. In the second part of this study, polishing is performed at the optimal slurry flow rate of 200 ml/min and wafer rotation rate of 148 RPM with different polishing pressures and platen rotation rates. Results indicate that 'delamination factor' is reduced significantly at the higher ratio of wafer to platen rotation rates.

AB - The effect of polisher kinematics on average and standard deviation of shear force and removal rate in copper CMP is investigated. A 'delamination factor' consisting of average shear force, standard deviation of shear force, and required polishing time is defined and calculated based on the summation of normalized values of the above three components. In general, low values of the 'delamination factor' are preferred since it is believed that they minimize defects during polishing. In the first part of this study, 200-mm blanket copper wafers are polished at constant platen rotation of 25 RPM and polishing pressure of 1.5 PSI with different wafer rotation rates and slurry flow rates. Results indicate that at the slurry flow rate of 200 ml/min, 'delamination factor' is lower by 14 to 54 percent than at 400 ml/min. Increasing wafer rotation rate from 23 to 148 RPM reduces 'delamination factor' by approximately 50 percent and improves removal rate within-wafer-non-uniformity by appx. 2X. In the second part of this study, polishing is performed at the optimal slurry flow rate of 200 ml/min and wafer rotation rate of 148 RPM with different polishing pressures and platen rotation rates. Results indicate that 'delamination factor' is reduced significantly at the higher ratio of wafer to platen rotation rates.

UR - http://www.scopus.com/inward/record.url?scp=77953997848&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77953997848&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:77953997848

SN - 9781605111308

VL - 1157

SP - 3

EP - 8

BT - Materials Research Society Symposium Proceedings

ER -