Packaging design support environment - a simulation system for analysis of VLSI interconnects

T. D. Whipple, Jerzy W Rozenblit, J. L. Prince, O. A. Palusinski

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

An X-Windows-based simulation environment has been developed for the prediction of electrical characteristics of integrated circuit packaging structures. This program, called Packaging Design Support Environment (PDSE), applies simulation management techniques to drive several tools that make the calculations. Two tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures with lossy dielectrics. A third tool uses these parameters to compute pulse response characteristics of multiple coupled, uniform, lossless transmission lines terminated at discrete points with R, L, and C elements. The design process in PDSE proceeds in three major phases: modeling, simulation, and evaluation. These processes are interactive and allow the designer to refine a design model, modify experiments, and apply various evaluation procedures.

Original languageEnglish (US)
Title of host publicationConference Proceedings - Annual Phoenix Conference
PublisherPubl by IEEE
Pages828-831
Number of pages4
ISBN (Print)0818620307
StatePublished - 1990
Externally publishedYes
EventProceedings - Ninth Annual International Phoenix Conference on Computers and Communications - Scottsdale, AZ, USA
Duration: Mar 21 1990Mar 23 1990

Other

OtherProceedings - Ninth Annual International Phoenix Conference on Computers and Communications
CityScottsdale, AZ, USA
Period3/21/903/23/90

Fingerprint

Packaging
Inductance
Integrated circuits
Electric lines
Capacitance
Computer simulation
Experiments

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Whipple, T. D., Rozenblit, J. W., Prince, J. L., & Palusinski, O. A. (1990). Packaging design support environment - a simulation system for analysis of VLSI interconnects. In Conference Proceedings - Annual Phoenix Conference (pp. 828-831). Publ by IEEE.

Packaging design support environment - a simulation system for analysis of VLSI interconnects. / Whipple, T. D.; Rozenblit, Jerzy W; Prince, J. L.; Palusinski, O. A.

Conference Proceedings - Annual Phoenix Conference. Publ by IEEE, 1990. p. 828-831.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Whipple, TD, Rozenblit, JW, Prince, JL & Palusinski, OA 1990, Packaging design support environment - a simulation system for analysis of VLSI interconnects. in Conference Proceedings - Annual Phoenix Conference. Publ by IEEE, pp. 828-831, Proceedings - Ninth Annual International Phoenix Conference on Computers and Communications, Scottsdale, AZ, USA, 3/21/90.
Whipple TD, Rozenblit JW, Prince JL, Palusinski OA. Packaging design support environment - a simulation system for analysis of VLSI interconnects. In Conference Proceedings - Annual Phoenix Conference. Publ by IEEE. 1990. p. 828-831
Whipple, T. D. ; Rozenblit, Jerzy W ; Prince, J. L. ; Palusinski, O. A. / Packaging design support environment - a simulation system for analysis of VLSI interconnects. Conference Proceedings - Annual Phoenix Conference. Publ by IEEE, 1990. pp. 828-831
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