Packaging design support environment - a simulation system for analysis of VLSI interconnects

T. D. Whipple, J. W. Rozenblit, J. L. Prince, O. A. Palusinski

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

An X-Windows-based simulation environment has been developed for the prediction of electrical characteristics of integrated circuit packaging structures. This program, called Packaging Design Support Environment (PDSE), applies simulation management techniques to drive several tools that make the calculations. Two tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures with lossy dielectrics. A third tool uses these parameters to compute pulse response characteristics of multiple coupled, uniform, lossless transmission lines terminated at discrete points with R, L, and C elements. The design process in PDSE proceeds in three major phases: modeling, simulation, and evaluation. These processes are interactive and allow the designer to refine a design model, modify experiments, and apply various evaluation procedures.

Original languageEnglish (US)
Title of host publicationConference Proceedings - Annual Phoenix Conference
PublisherPubl by IEEE
Pages828-831
Number of pages4
ISBN (Print)0818620307
StatePublished - Dec 1 1990
Externally publishedYes
EventProceedings - Ninth Annual International Phoenix Conference on Computers and Communications - Scottsdale, AZ, USA
Duration: Mar 21 1990Mar 23 1990

Publication series

NameConference Proceedings - Annual Phoenix Conference

Other

OtherProceedings - Ninth Annual International Phoenix Conference on Computers and Communications
CityScottsdale, AZ, USA
Period3/21/903/23/90

ASJC Scopus subject areas

  • Engineering(all)

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