Packaging issues for free-space interconnects at the board level

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Many researchers have proposed free-space optical interconnects as an alternative to electrical and optical guided wave techniques for connecting electronic or optical processors. However, little discussion has been given to problems associated with system packaging. This paper provides an overview of several important issues in yjis area which must be solved prior to realizing free-space optical interconnect systems.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsJohn A. Neff
PublisherPubl by Int Soc for Optical Engineering
Pages72-80
Number of pages9
ISBN (Print)0819406910
StatePublished - Dec 1 1991
EventOptical Enhancements to Computing Technology - San Diego, CA, USA
Duration: Jul 22 1991Jul 23 1991

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume1563
ISSN (Print)0277-786X

Other

OtherOptical Enhancements to Computing Technology
CitySan Diego, CA, USA
Period7/22/917/23/91

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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  • Cite this

    Kostuk, R. K. (1991). Packaging issues for free-space interconnects at the board level. In J. A. Neff (Ed.), Proceedings of SPIE - The International Society for Optical Engineering (pp. 72-80). (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 1563). Publ by Int Soc for Optical Engineering.