Pad surfacemicrostructure and optimization of the conditioning sweep

L. Borucki, X. Wei, Y. Zhuang, A. Philipossian, D. Slutz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

This paper investigates the question of whether optimization of the conditioning sweep schedule on a commercial rotary polishing tool to produce and maintain the flattest possible macroscopic pad surface can produce, as a side effect, significant changes in pad microscopic surface topography. We first condition a pad to steady state using a sinusoidal sweep and a well-characterized conditioner and measure both the macroscopic pad thickness profile and the microscopic topography at several radii. Tool operational parameters and conditioner data are then used in a pad conditioning model to successfully match the measured macroscopic pad thickness profile. We find in matching the profile that the subpad elastic modulus significantly affects the predicted pad thickness variation. After using the model to optimize the conditioning sweep, we then repeat the steady state conditioning experiment to verify that the pad meets flatness expectations and measure changes in the microscopic surface texture.

Original languageEnglish (US)
Title of host publicationICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings
PublisherVDE Verlag GmbH
Pages367-371
Number of pages5
ISBN (Electronic)9783800730650
StatePublished - 2007
Event2007 International Conference on Planarization/CMP Technology, ICPT 2007 - Dresden, Germany
Duration: Oct 25 2007Oct 27 2007

Publication series

NameICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings

Conference

Conference2007 International Conference on Planarization/CMP Technology, ICPT 2007
CountryGermany
CityDresden
Period10/25/0710/27/07

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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