Pad-wafer-slurry interface information from force data

L. Borucki, Y. Sampurno, A. Philipossian

Research output: Contribution to journalArticle

Abstract

This paper describes a model and algorithm for converting pad-wafer shear force and normal force data measured during chemical-mechanical planarization (CMP) into information about the conditions at the lubricated interface between the pad and wafer. Insight into this interface has been notably difficult due to its inaccessibility. Results indicate that force data contain detailed information about the wafer attitude relative to the pad and information about mean solid contact and fluid pressures in the interface. Fluid pressures are particularly interesting since they are difficult to detect directly but are coupled to solid contact pressures and can therefore affect uniformity. Fluid pressures can also underlie problems like wafer slippage. As part of the analysis of the model, we derive a highly accurate analytic approximation to the solution of the Reynolds equation for the mean fluid pressure in the slurry layer during CMP. Two algorithms are discussed for converting force data. The fastest is considerably faster than real-time force acquisition.

Original languageEnglish (US)
Pages (from-to)P3133-P3144
JournalECS Journal of Solid State Science and Technology
Volume8
Issue number5
DOIs
StatePublished - Jan 1 2019
Externally publishedYes

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Chemical mechanical polishing
Fluids
Contacts (fluid mechanics)
Reynolds equation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Pad-wafer-slurry interface information from force data. / Borucki, L.; Sampurno, Y.; Philipossian, A.

In: ECS Journal of Solid State Science and Technology, Vol. 8, No. 5, 01.01.2019, p. P3133-P3144.

Research output: Contribution to journalArticle

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