Particle Deposition and Removal of Relevance to Wet Processing in Semiconductor Manufacturing

Chieh Chun Chiang, Bing Wu, Srini Raghavan

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

Removal of particulate contaminants from surfaces is a critical area in the processing of wafers to build integrated circuits and is typically done using wet chemical formulations. Strategies for particle removal require an understanding of particle deposition mechanisms. In the first part of this review paper, colloid chemical principles underlying particle deposition on surfaces is discussed. Specifically, the importance of van der Waals and electrical double layer interaction energy on particle-surface interaction is reviewed. This is followed by a description of commonly used particle removal methods in wafer processing, viz., megasonic cleaning, brush cleaning, and nanospray cleaning. The importance of particle deposition conditions used in research on particle removal efficiency is highlighted through a study on the effect of aging.

Original languageEnglish (US)
Pages (from-to)546-553
Number of pages8
JournalParticulate Science and Technology
Volume33
Issue number5
DOIs
StatePublished - Sep 3 2015

Keywords

  • megasonic cleaning
  • particle deposition
  • particle removal
  • wet processing of wafers

ASJC Scopus subject areas

  • Chemical Engineering(all)

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