Particle Deposition and Removal of Relevance to Wet Processing in Semiconductor Manufacturing

Chieh Chun Chiang, Bing Wu, Srini Raghavan

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Removal of particulate contaminants from surfaces is a critical area in the processing of wafers to build integrated circuits and is typically done using wet chemical formulations. Strategies for particle removal require an understanding of particle deposition mechanisms. In the first part of this review paper, colloid chemical principles underlying particle deposition on surfaces is discussed. Specifically, the importance of van der Waals and electrical double layer interaction energy on particle-surface interaction is reviewed. This is followed by a description of commonly used particle removal methods in wafer processing, viz., megasonic cleaning, brush cleaning, and nanospray cleaning. The importance of particle deposition conditions used in research on particle removal efficiency is highlighted through a study on the effect of aging.

Original languageEnglish (US)
Pages (from-to)546-553
Number of pages8
JournalParticulate Science and Technology
Volume33
Issue number5
DOIs
StatePublished - Sep 3 2015

Fingerprint

Semiconductor materials
Cleaning
Processing
Colloids
Brushes
Particles (particulate matter)
Integrated circuits
Aging of materials
Impurities

Keywords

  • megasonic cleaning
  • particle deposition
  • particle removal
  • wet processing of wafers

ASJC Scopus subject areas

  • Chemical Engineering(all)

Cite this

Particle Deposition and Removal of Relevance to Wet Processing in Semiconductor Manufacturing. / Chiang, Chieh Chun; Wu, Bing; Raghavan, Srini.

In: Particulate Science and Technology, Vol. 33, No. 5, 03.09.2015, p. 546-553.

Research output: Contribution to journalArticle

@article{162654171f8d47378040eee9158e64c5,
title = "Particle Deposition and Removal of Relevance to Wet Processing in Semiconductor Manufacturing",
abstract = "Removal of particulate contaminants from surfaces is a critical area in the processing of wafers to build integrated circuits and is typically done using wet chemical formulations. Strategies for particle removal require an understanding of particle deposition mechanisms. In the first part of this review paper, colloid chemical principles underlying particle deposition on surfaces is discussed. Specifically, the importance of van der Waals and electrical double layer interaction energy on particle-surface interaction is reviewed. This is followed by a description of commonly used particle removal methods in wafer processing, viz., megasonic cleaning, brush cleaning, and nanospray cleaning. The importance of particle deposition conditions used in research on particle removal efficiency is highlighted through a study on the effect of aging.",
keywords = "megasonic cleaning, particle deposition, particle removal, wet processing of wafers",
author = "Chiang, {Chieh Chun} and Bing Wu and Srini Raghavan",
year = "2015",
month = "9",
day = "3",
doi = "10.1080/02726351.2015.1060654",
language = "English (US)",
volume = "33",
pages = "546--553",
journal = "Particulate Science and Technology",
issn = "0272-6351",
publisher = "Taylor and Francis Ltd.",
number = "5",

}

TY - JOUR

T1 - Particle Deposition and Removal of Relevance to Wet Processing in Semiconductor Manufacturing

AU - Chiang, Chieh Chun

AU - Wu, Bing

AU - Raghavan, Srini

PY - 2015/9/3

Y1 - 2015/9/3

N2 - Removal of particulate contaminants from surfaces is a critical area in the processing of wafers to build integrated circuits and is typically done using wet chemical formulations. Strategies for particle removal require an understanding of particle deposition mechanisms. In the first part of this review paper, colloid chemical principles underlying particle deposition on surfaces is discussed. Specifically, the importance of van der Waals and electrical double layer interaction energy on particle-surface interaction is reviewed. This is followed by a description of commonly used particle removal methods in wafer processing, viz., megasonic cleaning, brush cleaning, and nanospray cleaning. The importance of particle deposition conditions used in research on particle removal efficiency is highlighted through a study on the effect of aging.

AB - Removal of particulate contaminants from surfaces is a critical area in the processing of wafers to build integrated circuits and is typically done using wet chemical formulations. Strategies for particle removal require an understanding of particle deposition mechanisms. In the first part of this review paper, colloid chemical principles underlying particle deposition on surfaces is discussed. Specifically, the importance of van der Waals and electrical double layer interaction energy on particle-surface interaction is reviewed. This is followed by a description of commonly used particle removal methods in wafer processing, viz., megasonic cleaning, brush cleaning, and nanospray cleaning. The importance of particle deposition conditions used in research on particle removal efficiency is highlighted through a study on the effect of aging.

KW - megasonic cleaning

KW - particle deposition

KW - particle removal

KW - wet processing of wafers

UR - http://www.scopus.com/inward/record.url?scp=84942293190&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84942293190&partnerID=8YFLogxK

U2 - 10.1080/02726351.2015.1060654

DO - 10.1080/02726351.2015.1060654

M3 - Article

AN - SCOPUS:84942293190

VL - 33

SP - 546

EP - 553

JO - Particulate Science and Technology

JF - Particulate Science and Technology

SN - 0272-6351

IS - 5

ER -