Performance of a novel slurry injection system on an ebara F-REX200® polisher for a silicon dioxide CMP application

Leonard Borucki, Yun Zhuang, Yasa Sampurno, Ara Philipossian, Sascha Kreutzer-Schneeweiss

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We describe a new type of slurry injection system (SIS-100) along with data on removal rate, non-uniformity, wafer-level defects, and slurry savings obtained on an Ebara FREX200® polisher using SS25™ slurry on both k-groove and XY-perforated IC1000™ pads. The system tested is installed in parallel with the standard slurry applicator using existing polisher hardware and does not require power, software, or any process changes except for flow rate. The injector contacts the pad with a light load and applies slurry in a thin layer at the device trailing edge using single or multiple injection points. Used slurry, rinse water and pad debris are then removed from the pad by the leading edge. At each flow rate, the removal rate is enhanced sufficiently over the rate from the standard slurry applicator that the flow rate can be reduced by about 30% on the XY-perforated pad and 50% on the k-groove pad without sacrificing removal rate. Non-uniformity is found to be unchanged and defect levels are found to be the same or better compared with the standard applicator.

Original languageEnglish (US)
Title of host publicationICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings
PublisherVDE Verlag GmbH
Pages35-40
Number of pages6
ISBN (Electronic)9783800734528
StatePublished - 2012
Externally publishedYes
Event2012 International Conference on Planarization/CMP Technology, ICPT 2012 - Grenoble, France
Duration: Oct 15 2012Oct 17 2012

Publication series

NameICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings

Conference

Conference2012 International Conference on Planarization/CMP Technology, ICPT 2012
Country/TerritoryFrance
CityGrenoble
Period10/15/1210/17/12

Keywords

  • Chemical-mechanical Polishing
  • Defects
  • F-REX200®
  • Slurry Application
  • Slurry Reduction

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electronic, Optical and Magnetic Materials

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