Peridynamic Direct Concentration Approach by Using ANSYS

S. W. Han, C. Diyaroglu, S. Oterkus, Erdogan Madenci, E. Oterkus, Y. Hwang, H. Seol

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

Moisture can have damaging effects on electronic packages by inducing hygro-Thermo-mechanical stresses and vapor pressure. Commonly accepted wetness approach for indirect calculation of moisture concentration can yield unrealistic results. Therefore, a direct concentration approach becomes unavoidable. This study presents the Peridynamic Direct Concentration Approach (PDCA) and its implementation in ANSYS, a commercial finite element software. Numerical results show that PDCA provides accurate predictions, and removes the anomalies associated with the wetness approach. Moreover, ANSYS allows the utilization of implicit time integration resulting in significant computational advantages.

Original languageEnglish (US)
Title of host publicationProceedings - ECTC 2016: 66th Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages544-549
Number of pages6
Volume2016-August
ISBN (Electronic)9781509012039
DOIs
StatePublished - Aug 16 2016
Event66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States
Duration: May 31 2016Jun 3 2016

Other

Other66th IEEE Electronic Components and Technology Conference, ECTC 2016
CountryUnited States
CityLas Vegas
Period5/31/166/3/16

Keywords

  • Direct
  • Moisture
  • Peridynamics
  • Wetness

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Han, S. W., Diyaroglu, C., Oterkus, S., Madenci, E., Oterkus, E., Hwang, Y., & Seol, H. (2016). Peridynamic Direct Concentration Approach by Using ANSYS. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference (Vol. 2016-August, pp. 544-549). [7545484] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2016.251