Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages

Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Abstract

This study presents an application of the peridynamic theory to investigate failure propagation in a multi-layer thin-film structure of electronic packages. A brief description of this non-local theory is presented prior to the statement of the problem. The mathematical description of the theory and its validation by considering a well-known dynamic fracture problem are discussed subsequently. Finally, the crack propagation path in a multilayer thin-film structure predicted by the peridynamic theory was compared against measurements from nanoindentation experiments.

Original languageEnglish (US)
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages1614-1619
Number of pages6
DOIs
StatePublished - Sep 15 2008
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: May 27 2008May 30 2008

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
CountryUnited States
CityLake Buena Vista, FL
Period5/27/085/30/08

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Agwai, A., Guven, I., & Madenci, E. (2008). Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC (pp. 1614-1619). [4550192] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2008.4550192