Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages

Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

This study presents an application of the peridynamic theory to investigate failure propagation in a multi-layer thin-film structure of electronic packages. A brief description of this non-local theory is presented prior to the statement of the problem. The mathematical description of the theory and its validation by considering a well-known dynamic fracture problem are discussed subsequently. Finally, the crack propagation path in a multilayer thin-film structure predicted by the peridynamic theory was compared against measurements from nanoindentation experiments.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages1614-1619
Number of pages6
DOIs
StatePublished - 2008
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: May 27 2008May 30 2008

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
CountryUnited States
CityLake Buena Vista, FL
Period5/27/085/30/08

Fingerprint

Multilayer films
Thin films
Nanoindentation
Crack propagation
Experiments

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Agwai, A., Guven, I., & Madenci, E. (2008). Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages. In Proceedings - Electronic Components and Technology Conference (pp. 1614-1619). [4550192] https://doi.org/10.1109/ECTC.2008.4550192

Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages. / Agwai, Abigail; Guven, Ibrahim; Madenci, Erdogan.

Proceedings - Electronic Components and Technology Conference. 2008. p. 1614-1619 4550192.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Agwai, A, Guven, I & Madenci, E 2008, Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages. in Proceedings - Electronic Components and Technology Conference., 4550192, pp. 1614-1619, 2008 58th Electronic Components and Technology Conference, ECTC, Lake Buena Vista, FL, United States, 5/27/08. https://doi.org/10.1109/ECTC.2008.4550192
Agwai A, Guven I, Madenci E. Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages. In Proceedings - Electronic Components and Technology Conference. 2008. p. 1614-1619. 4550192 https://doi.org/10.1109/ECTC.2008.4550192
Agwai, Abigail ; Guven, Ibrahim ; Madenci, Erdogan. / Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages. Proceedings - Electronic Components and Technology Conference. 2008. pp. 1614-1619
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