Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop

Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Scopus citations

Abstract

In this study, peridynamic meory is used to investigate dynamic response of electronic packages subjected to impact loading arising from drop-shock. First, the theory is briefly described, followed by validation against a fundamental dynamic fracture problem. Finally, peridynamic theory was demonstrated by considering a drop test experiment.

Original languageEnglish (US)
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages1048-1053
Number of pages6
DOIs
StatePublished - Sep 16 2008
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: May 27 2008May 30 2008

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
CountryUnited States
CityLake Buena Vista, FL
Period5/27/085/30/08

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Agwai, A., Guven, I., & Madenci, E. (2008). Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC (pp. 1048-1053). [4550105] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2008.4550105