Peridynamic theory for simulation of failure mechanisms in electronic packages

Erkan Oterkus, Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Peridynamic theory is employed to investigate crack propagation in a multi-layer thin-film structure of electronic packages and in single layer graphene sheets. A brief description of this non-local theory is presented. Crack propagation path in patterned multilayer thin-film structures predicted by the peridynamic theory is compared against measurements from cross-sectional nanoindentation experiments. Single layer graphene sheet simulation results are compared to molecular dynamic simulations.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages63-68
Number of pages6
Volume2
DOIs
StatePublished - 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: Jul 19 2009Jul 23 2009

Other

Other2009 ASME InterPack Conference, IPACK2009
CountryUnited States
CitySan Francisco, CA
Period7/19/097/23/09

Fingerprint

Graphene
Crack propagation
Thin films
Multilayer films
Nanoindentation
Molecular dynamics
Computer simulation
Experiments

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Oterkus, E., Agwai, A., Guven, I., & Madenci, E. (2010). Peridynamic theory for simulation of failure mechanisms in electronic packages. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (Vol. 2, pp. 63-68) https://doi.org/10.1115/InterPACK2009-89107

Peridynamic theory for simulation of failure mechanisms in electronic packages. / Oterkus, Erkan; Agwai, Abigail; Guven, Ibrahim; Madenci, Erdogan.

Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2 2010. p. 63-68.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Oterkus, E, Agwai, A, Guven, I & Madenci, E 2010, Peridynamic theory for simulation of failure mechanisms in electronic packages. in Proceedings of the ASME InterPack Conference 2009, IPACK2009. vol. 2, pp. 63-68, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, United States, 7/19/09. https://doi.org/10.1115/InterPACK2009-89107
Oterkus E, Agwai A, Guven I, Madenci E. Peridynamic theory for simulation of failure mechanisms in electronic packages. In Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2. 2010. p. 63-68 https://doi.org/10.1115/InterPACK2009-89107
Oterkus, Erkan ; Agwai, Abigail ; Guven, Ibrahim ; Madenci, Erdogan. / Peridynamic theory for simulation of failure mechanisms in electronic packages. Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2 2010. pp. 63-68
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