Peridynamic theory for simulation of failure mechanisms in electronic packages

Erkan Oterkus, Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Peridynamic theory is employed to investigate crack propagation in a multi-layer thin-film structure of electronic packages and in single layer graphene sheets. A brief description of this non-local theory is presented. Crack propagation path in patterned multilayer thin-film structures predicted by the peridynamic theory is compared against measurements from cross-sectional nanoindentation experiments. Single layer graphene sheet simulation results are compared to molecular dynamic simulations.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages63-68
Number of pages6
DOIs
StatePublished - Jun 30 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: Jul 19 2009Jul 23 2009

Publication series

NameProceedings of the ASME InterPack Conference 2009, IPACK2009
Volume2

Other

Other2009 ASME InterPack Conference, IPACK2009
CountryUnited States
CitySan Francisco, CA
Period7/19/097/23/09

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Oterkus, E., Agwai, A., Guven, I., & Madenci, E. (2010). Peridynamic theory for simulation of failure mechanisms in electronic packages. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (pp. 63-68). (Proceedings of the ASME InterPack Conference 2009, IPACK2009; Vol. 2). https://doi.org/10.1115/InterPACK2009-89107