A unique technique of mask-less and self-aligned silicon etch between bonded wafers was developed and applied to fabricate a microchannel heat sink integrated with a heater and an array of temperature sensors. The technique allowed the formation of self-aligned and self-stopped etching of grooves between the bonded wafers. The device, consisting of distributed temperature microsensors, allowed direct temperature measurements for different levels of power dissipation under forced convection using either nitrogen or water as working fluids. The measured temperature distributions are used to characterize the micro heat sink performance under forced convection boiling conditions. The onset of critical heat flux (CHF) condition was investigated for different channel size and liquid flow-rate. The results suggest that the bubble dynamic mechanism in microchannel might be different compared with conventional channels.
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering