Abstract
An alternative to conventional CMP termed pad-in-a-bottle (PIB) polishing is reported, in which the polyurethane polishing pad is replaced by a stiff polycarbonate counterface, and polyurethane beads 10-50 μm in diameter are used in conjunction with slurry and slurry particles to achieve planarization. Blanket oxide wafer PIB experiments demonstrate effective oxide removal. Patterned wafer PIB experiments show improved dishing in STI test wafers. A new dual-material PIB model has been developed and fit to the experimental data. Exploratory simulations show that the primary source of reduced pattern dependent dishing is the use of the stiff counterface as enabled by the compliant beads.
| Original language | English (US) |
|---|---|
| Title of host publication | 2015 International Conference on Planarization/CMP Technology, ICPT 2015 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Print) | 9781619565104 |
| State | Published - Feb 17 2016 |
| Event | International Conference on Planarization/CMP Technology, ICPT 2015 - Chandler, United States Duration: Sep 30 2015 → Oct 2 2015 |
Other
| Other | International Conference on Planarization/CMP Technology, ICPT 2015 |
|---|---|
| Country | United States |
| City | Chandler |
| Period | 9/30/15 → 10/2/15 |
ASJC Scopus subject areas
- Process Chemistry and Technology
- Electronic, Optical and Magnetic Materials
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Boning, D., Fan, W., Zhuang, Y., Sampurno, Y., & Philipossian, A. (2016). Planarization with suspended polyurethane beads and a stiff counterface: Pad-in-a-bottle experiments and simulation. In 2015 International Conference on Planarization/CMP Technology, ICPT 2015 [7411978] Institute of Electrical and Electronics Engineers Inc..