Planarization with suspended polyurethane beads and a stiff counterface: Pad-in-a-bottle experiments and simulation

Duane Boning, Wei Fan, Yun Zhuang, Yasa Sampurno, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An alternative to conventional CMP termed pad-in-a-bottle (PIB) polishing is reported, in which the polyurethane polishing pad is replaced by a stiff polycarbonate counterface, and polyurethane beads 10-50 μm in diameter are used in conjunction with slurry and slurry particles to achieve planarization. Blanket oxide wafer PIB experiments demonstrate effective oxide removal. Patterned wafer PIB experiments show improved dishing in STI test wafers. A new dual-material PIB model has been developed and fit to the experimental data. Exploratory simulations show that the primary source of reduced pattern dependent dishing is the use of the stiff counterface as enabled by the compliant beads.

Original languageEnglish (US)
Title of host publication2015 International Conference on Planarization/CMP Technology, ICPT 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781619565104
StatePublished - Feb 17 2016
EventInternational Conference on Planarization/CMP Technology, ICPT 2015 - Chandler, United States
Duration: Sep 30 2015Oct 2 2015

Other

OtherInternational Conference on Planarization/CMP Technology, ICPT 2015
CountryUnited States
CityChandler
Period9/30/1510/2/15

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electronic, Optical and Magnetic Materials

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    Boning, D., Fan, W., Zhuang, Y., Sampurno, Y., & Philipossian, A. (2016). Planarization with suspended polyurethane beads and a stiff counterface: Pad-in-a-bottle experiments and simulation. In 2015 International Conference on Planarization/CMP Technology, ICPT 2015 [7411978] Institute of Electrical and Electronics Engineers Inc..