Pole-residue formulation for transient simulation of high-frequency interconnects using householder LS curve-fitting techniques

Mark Elzinga, Kathleen L. Virga, Li Zhao, John L. Prince

Research output: Contribution to journalArticle


As digital circuits approach the GHz range, and as the need for high performance wireless devices increases, new simulation tools which accurately characterize high frequency interconnects are needed. In this paper, a new macromodeling algorithm for time domain simulation of interconnects is presented. The algorithm incorporates Householder LS curve-fitting techniques. The approach generates a universal macromodeling tool that enables simulation of interconnects in a modified version of simulation program with integrated circuit emphasis (SPICE). This results in a method that conveniently incorporates accurate EM models of interconnects or experimental data into a circuit simulator. The time domain simulation results using this new tool are compared with results from other simulators.

Original languageEnglish (US)
Pages (from-to)142-147
Number of pages6
JournalIEEE Transactions on Advanced Packaging
Issue number2
StatePublished - Dec 3 2000
Externally publishedYes


ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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