As digital circuits approach the GHz range, and as the need for high performance wireless devices increases, new simulation tools which accurately characterize high frequency interconnects are needed. In this paper, a new macromodeling algorithm for time domain simulation of interconnects is presented. The algorithm incorporates Householder LS curve-fitting techniques. The approach generates a universal macromodeling tool that enables simulation of interconnects in a modified version of simulation program with integrated circuit emphasis (SPICE). This results in a method that conveniently incorporates accurate EM models of interconnects or experimental data into a circuit simulator. The time domain simulation results using this new tool are compared with results from other simulators.
ASJC Scopus subject areas
- Electrical and Electronic Engineering