Pole - residue formulation for transient simulation of high-speed interconnects using householder LS curve-fitting techniques

Mark Elzinga, Kathleen L. Virga, Li Zhao, John L. Prince

Research output: Contribution to journalConference article

Abstract

As digital circuits approach the GHz range, and as the need for high performance wireless devices increases, new simulation tools which accurately characterize high speed interconnects are needed. In this paper, a new macromodelling algorithm for time domain simulation of interconnects is presented. The algorithm incorporates Householder LS curve-fitting techniques. The approach generates a universal macromodelling tool that enables simulation of interconnects in a modified version of SPICE. This results in a method that conveniently incorporates accurate EM models of interconnects, or experimental data into a circuit simulator. The time domain simulation results using this new tool are compared with results from other simulators.

Original languageEnglish (US)
Pages (from-to)500-505
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
StatePublished - Jan 1 1999
EventProceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA
Duration: Jun 1 1999Jun 4 1999

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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