Post assembly warpage prediction using refined zigzag element

Bahattin Kilic, Atila Barut, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage inis essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages2255-2258
Number of pages4
DOIs
StatePublished - 2013
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: May 28 2013May 31 2013

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CountryUnited States
CityLas Vegas, NV
Period5/28/135/31/13

Fingerprint

Dimensional stability
Electronics industry
Substrates
Materials properties
Topology
Finite element method
Direction compound

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kilic, B., Barut, A., & Madenci, E. (2013). Post assembly warpage prediction using refined zigzag element. In Proceedings - Electronic Components and Technology Conference (pp. 2255-2258). [6575896] https://doi.org/10.1109/ECTC.2013.6575896

Post assembly warpage prediction using refined zigzag element. / Kilic, Bahattin; Barut, Atila; Madenci, Erdogan.

Proceedings - Electronic Components and Technology Conference. 2013. p. 2255-2258 6575896.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kilic, B, Barut, A & Madenci, E 2013, Post assembly warpage prediction using refined zigzag element. in Proceedings - Electronic Components and Technology Conference., 6575896, pp. 2255-2258, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, United States, 5/28/13. https://doi.org/10.1109/ECTC.2013.6575896
Kilic B, Barut A, Madenci E. Post assembly warpage prediction using refined zigzag element. In Proceedings - Electronic Components and Technology Conference. 2013. p. 2255-2258. 6575896 https://doi.org/10.1109/ECTC.2013.6575896
Kilic, Bahattin ; Barut, Atila ; Madenci, Erdogan. / Post assembly warpage prediction using refined zigzag element. Proceedings - Electronic Components and Technology Conference. 2013. pp. 2255-2258
@inproceedings{388ceb4b81444bc5986f8d604e482e1b,
title = "Post assembly warpage prediction using refined zigzag element",
abstract = "Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage inis essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.",
author = "Bahattin Kilic and Atila Barut and Erdogan Madenci",
year = "2013",
doi = "10.1109/ECTC.2013.6575896",
language = "English (US)",
isbn = "9781479902330",
pages = "2255--2258",
booktitle = "Proceedings - Electronic Components and Technology Conference",

}

TY - GEN

T1 - Post assembly warpage prediction using refined zigzag element

AU - Kilic, Bahattin

AU - Barut, Atila

AU - Madenci, Erdogan

PY - 2013

Y1 - 2013

N2 - Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage inis essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.

AB - Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage inis essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.

UR - http://www.scopus.com/inward/record.url?scp=84883377587&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84883377587&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2013.6575896

DO - 10.1109/ECTC.2013.6575896

M3 - Conference contribution

SN - 9781479902330

SP - 2255

EP - 2258

BT - Proceedings - Electronic Components and Technology Conference

ER -