Post assembly warpage prediction using refined zigzag element

Bahattin Kilic, Atila Barut, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage inis essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.

Original languageEnglish (US)
Title of host publication2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages2255-2258
Number of pages4
DOIs
StatePublished - Sep 9 2013
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: May 28 2013May 31 2013

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CountryUnited States
CityLas Vegas, NV
Period5/28/135/31/13

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Post assembly warpage prediction using refined zigzag element'. Together they form a unique fingerprint.

  • Cite this

    Kilic, B., Barut, A., & Madenci, E. (2013). Post assembly warpage prediction using refined zigzag element. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 (pp. 2255-2258). [6575896] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2013.6575896