Potential failure sites in a flip-chip package with and without underfill

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

The thermal integrity of an electronic package depends on the strength of the interface between dissimilar materials. Due to high thermo-mechanical stress concentrations arising from large temperature excursions, electronic packages become prone to cracking at regions with geometric and/or material discontinuities. Thus, the accurate calculation of the thermo-mechanical stresses in regions of high stress concentrations is critical to achieving a reliable design. These high-stress-concentration regions pose a major concern, especially in the design of flip-chip packages. Understanding the mechanisms for relaxing the high stress concentrations through the use of appropriate material properties, bump and adhesive joint geometry, and filler size in a flip-chip package will aid in design improvements for ensuring the thermomechanical reliability of electronic packages. In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements capture the exact singular behavior of the stresses near the geometric and material discontinuities. Potential failure sites are established by applying concepts from fracture mechanics.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Applied Mechanics Division, AMD
Pages61-64
Number of pages4
Volume222
StatePublished - 1997

Fingerprint

Stress concentration
Dissimilar materials
Adhesive joints
Fracture mechanics
Fillers
Materials properties
Geometry
Temperature

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Madenci, E., Shkarayev, S. V., & Mahajan, R. (1997). Potential failure sites in a flip-chip package with and without underfill. In American Society of Mechanical Engineers, Applied Mechanics Division, AMD (Vol. 222, pp. 61-64)

Potential failure sites in a flip-chip package with and without underfill. / Madenci, Erdogan; Shkarayev, Sergey V; Mahajan, R.

American Society of Mechanical Engineers, Applied Mechanics Division, AMD. Vol. 222 1997. p. 61-64.

Research output: Chapter in Book/Report/Conference proceedingChapter

Madenci, E, Shkarayev, SV & Mahajan, R 1997, Potential failure sites in a flip-chip package with and without underfill. in American Society of Mechanical Engineers, Applied Mechanics Division, AMD. vol. 222, pp. 61-64.
Madenci E, Shkarayev SV, Mahajan R. Potential failure sites in a flip-chip package with and without underfill. In American Society of Mechanical Engineers, Applied Mechanics Division, AMD. Vol. 222. 1997. p. 61-64
Madenci, Erdogan ; Shkarayev, Sergey V ; Mahajan, R. / Potential failure sites in a flip-chip package with and without underfill. American Society of Mechanical Engineers, Applied Mechanics Division, AMD. Vol. 222 1997. pp. 61-64
@inbook{f2b1f51aaa7a46d084b2466a292bf080,
title = "Potential failure sites in a flip-chip package with and without underfill",
abstract = "The thermal integrity of an electronic package depends on the strength of the interface between dissimilar materials. Due to high thermo-mechanical stress concentrations arising from large temperature excursions, electronic packages become prone to cracking at regions with geometric and/or material discontinuities. Thus, the accurate calculation of the thermo-mechanical stresses in regions of high stress concentrations is critical to achieving a reliable design. These high-stress-concentration regions pose a major concern, especially in the design of flip-chip packages. Understanding the mechanisms for relaxing the high stress concentrations through the use of appropriate material properties, bump and adhesive joint geometry, and filler size in a flip-chip package will aid in design improvements for ensuring the thermomechanical reliability of electronic packages. In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements capture the exact singular behavior of the stresses near the geometric and material discontinuities. Potential failure sites are established by applying concepts from fracture mechanics.",
author = "Erdogan Madenci and Shkarayev, {Sergey V} and R. Mahajan",
year = "1997",
language = "English (US)",
volume = "222",
pages = "61--64",
booktitle = "American Society of Mechanical Engineers, Applied Mechanics Division, AMD",

}

TY - CHAP

T1 - Potential failure sites in a flip-chip package with and without underfill

AU - Madenci, Erdogan

AU - Shkarayev, Sergey V

AU - Mahajan, R.

PY - 1997

Y1 - 1997

N2 - The thermal integrity of an electronic package depends on the strength of the interface between dissimilar materials. Due to high thermo-mechanical stress concentrations arising from large temperature excursions, electronic packages become prone to cracking at regions with geometric and/or material discontinuities. Thus, the accurate calculation of the thermo-mechanical stresses in regions of high stress concentrations is critical to achieving a reliable design. These high-stress-concentration regions pose a major concern, especially in the design of flip-chip packages. Understanding the mechanisms for relaxing the high stress concentrations through the use of appropriate material properties, bump and adhesive joint geometry, and filler size in a flip-chip package will aid in design improvements for ensuring the thermomechanical reliability of electronic packages. In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements capture the exact singular behavior of the stresses near the geometric and material discontinuities. Potential failure sites are established by applying concepts from fracture mechanics.

AB - The thermal integrity of an electronic package depends on the strength of the interface between dissimilar materials. Due to high thermo-mechanical stress concentrations arising from large temperature excursions, electronic packages become prone to cracking at regions with geometric and/or material discontinuities. Thus, the accurate calculation of the thermo-mechanical stresses in regions of high stress concentrations is critical to achieving a reliable design. These high-stress-concentration regions pose a major concern, especially in the design of flip-chip packages. Understanding the mechanisms for relaxing the high stress concentrations through the use of appropriate material properties, bump and adhesive joint geometry, and filler size in a flip-chip package will aid in design improvements for ensuring the thermomechanical reliability of electronic packages. In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements capture the exact singular behavior of the stresses near the geometric and material discontinuities. Potential failure sites are established by applying concepts from fracture mechanics.

UR - http://www.scopus.com/inward/record.url?scp=0031387826&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031387826&partnerID=8YFLogxK

M3 - Chapter

VL - 222

SP - 61

EP - 64

BT - American Society of Mechanical Engineers, Applied Mechanics Division, AMD

ER -