Potential failure sites in a flip-chip package with and without underfill

Research output: Contribution to journalArticlepeer-review

41 Scopus citations

Abstract

In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements" capture the exact singular behavior of the stresses near the geometric and material discontinuities. Application of the strain energy density criterion indicates the possible failure sites and how they shift due to the presence of underfill.

Original languageEnglish (US)
Pages (from-to)336-341
Number of pages6
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume120
Issue number4
DOIs
StatePublished - Dec 1998

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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