Process optimization for a 3D optical coupler and waveguide fabrication on a single substrate using buffer coat material

Chris Summitt, Sunglin Wang, Lee Johnson, Melissa Zaverton, Tao Ge, Thomas D Milster, Yuzuru Takashima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have developed a hybrid lithography process necessary to fabricate a vertical optical coupler and an array of waveguide structures using the same buffer coat material on a single substrate. A virtual vernier scale built into the process enables precise alignment of both structures.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSPIE
Volume9374
ISBN (Print)9781628414646
DOIs
Publication statusPublished - 2015
EventAdvanced Fabrication Technologies for Micro/Nano Optics and Photonics VIII - San Francisco, United States
Duration: Feb 8 2015Feb 11 2015

Other

OtherAdvanced Fabrication Technologies for Micro/Nano Optics and Photonics VIII
CountryUnited States
CitySan Francisco
Period2/8/152/11/15

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Keywords

  • CMOS compatible fabrication
  • micro optics
  • Optical Coupler
  • silicon photonics
  • waveguide

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Summitt, C., Wang, S., Johnson, L., Zaverton, M., Ge, T., Milster, T. D., & Takashima, Y. (2015). Process optimization for a 3D optical coupler and waveguide fabrication on a single substrate using buffer coat material. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 9374). [937415] SPIE. https://doi.org/10.1117/12.2080425