Quantitative in-situ measurement of asperity compression during chemical mechanical planarization

Caprice Gray, Daniel Apone, Chris Rogers, Vincent P. Manno, Chris Barns, Sriram Anjur, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Modifications to the Dual Emission Laser Induced Fluorescence (DELIF) procedure used to collect images of the slurry layer between the polishing pad and wafer during Chemical Mechanical Planarization (CMP) have provided a means to attain instantaneous, high spatial resolution images of slurry film thickness. Presented here is a technique to determine the calibration factor that correlates image intensity to slurry film thickness. This presentation will discuss how to determine slurry layer shape near wafer features, pad roughness, and pad compressibility.

Original languageEnglish (US)
Title of host publicationProceedings of the World Tribology Congress III - 2005
Pages425-426
Number of pages2
StatePublished - Dec 1 2005
Event2005 World Tribology Congress III - Washington, D.C., United States
Duration: Sep 12 2005Sep 16 2005

Publication series

NameProceedings of the World Tribology Congress III - 2005

Other

Other2005 World Tribology Congress III
CountryUnited States
CityWashington, D.C.
Period9/12/059/16/05

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Gray, C., Apone, D., Rogers, C., Manno, V. P., Barns, C., Anjur, S., & Philipossian, A. (2005). Quantitative in-situ measurement of asperity compression during chemical mechanical planarization. In Proceedings of the World Tribology Congress III - 2005 (pp. 425-426). (Proceedings of the World Tribology Congress III - 2005).