Rapid electromagnetic analysis of multilayer interconnects

D. Heckmann, Steven L Dvorak, A. C. Cangellaris

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a closed-form solution is presented for the individual elements of the impedance matrix generated by the application of the Method of Moments to the integral equation solution of shielded multiconductor structures. Using these expressions, impedance matrix fill time is reduced by one to four orders of magnitude.

Original languageEnglish (US)
Title of host publicationIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Editors Anon
PublisherIEEE
Pages232-235
Number of pages4
StatePublished - 1997
EventProceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging - San Jose, CA, USA
Duration: Oct 27 1997Oct 29 1997

Other

OtherProceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging
CitySan Jose, CA, USA
Period10/27/9710/29/97

Fingerprint

Multilayers
Method of moments
Integral equations

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Heckmann, D., Dvorak, S. L., & Cangellaris, A. C. (1997). Rapid electromagnetic analysis of multilayer interconnects. In Anon (Ed.), IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 232-235). IEEE.

Rapid electromagnetic analysis of multilayer interconnects. / Heckmann, D.; Dvorak, Steven L; Cangellaris, A. C.

IEEE Topical Meeting on Electrical Performance of Electronic Packaging. ed. / Anon. IEEE, 1997. p. 232-235.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heckmann, D, Dvorak, SL & Cangellaris, AC 1997, Rapid electromagnetic analysis of multilayer interconnects. in Anon (ed.), IEEE Topical Meeting on Electrical Performance of Electronic Packaging. IEEE, pp. 232-235, Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, USA, 10/27/97.
Heckmann D, Dvorak SL, Cangellaris AC. Rapid electromagnetic analysis of multilayer interconnects. In Anon, editor, IEEE Topical Meeting on Electrical Performance of Electronic Packaging. IEEE. 1997. p. 232-235
Heckmann, D. ; Dvorak, Steven L ; Cangellaris, A. C. / Rapid electromagnetic analysis of multilayer interconnects. IEEE Topical Meeting on Electrical Performance of Electronic Packaging. editor / Anon. IEEE, 1997. pp. 232-235
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