Rapid thermal annealing of polysilicon thin films

Xin Zhang, Tong Yi Zhang, Man Wong, Yitshak Zohar

Research output: Contribution to journalArticle

63 Scopus citations

Abstract

In comparison with conventional heat treatment, high-temperature rapid thermal annealing (RTA) in a radio frequency (RF) induction-heated system can reduce or eliminate residual stresses in thin films in a few seconds. In this work, changes in the stress level due to the RTA of polycrystalline silicon thin films were studied as a function of annealing time and temperature. The corresponding variations in the microstructure and surface layer of the thin films were experimentally investigated by a variety of analytical tools. The results suggest that the residual stress evolution during annealing is dominated by two mechanisms: 1) microstructure variations of the polysilicon thin film and 2) effects of a surface layer formed during the heat treatment. The fact that the microstructure changes are more pronounced in samples after conventional heat treatment implies that the effects of the formed surface layer may dominate the final state of the residual stress in the thin film. [337].

Original languageEnglish (US)
Pages (from-to)356-363
Number of pages8
JournalJournal of Microelectromechanical Systems
Volume7
Issue number4
DOIs
Publication statusPublished - Dec 1998
Externally publishedYes

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Keywords

  • Polysilicon thin films
  • Rapid thermal annealing
  • Residual stress

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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