Realization and application of a 111 million pixel backside-illuminated detector and camera

Norbert Zacharias, Bryan Dorland, Richard Bredthauer, Kasey Boggs, Greg Bredthauer, Michael P Lesser

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

A full-wafer, 10,580 × 10,560 pixel (95 × 95 mm) CCD was designed and tested at Semiconductor Technology Associates (STA) with 9 μm. square pixels and 16 outputs. The chip was successfully fabricated in 2006 at DALSA and some performance results are presented here. This program was funded by the Office of Naval Research through a Small Business Innovation in Research (SBIR) program requested by the U.S. Naval Observatory for its next generation astrometric sky survey programs. Using Leach electronics, low read-noise output of the 111 million pixels requires 16 seconds at 0.9 MHz. Alternative electronics developed at STA allow readout at 20 MHz. Some modifications of the design to include anti-blooming features, a larger number of outputs, and use of p-channel material for space applications are discussed.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Volume6690
DOIs
StatePublished - 2007
EventFocal Plane Arrays for Space Telescopes III - San Diego, CA, United States
Duration: Aug 27 2007Aug 28 2007

Other

OtherFocal Plane Arrays for Space Telescopes III
CountryUnited States
CitySan Diego, CA
Period8/27/078/28/07

Fingerprint

Pixels
Cameras
pixels
cameras
Detectors
output
detectors
Electronic equipment
Semiconductor materials
Space applications
Observatories
electronics
Charge coupled devices
readout
charge coupled devices
observatories
Innovation
chips
wafers
Industry

Keywords

  • All-sky-survey
  • Astrometry
  • Large-format CCD
  • Space situational awareness
  • Star tracker

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Zacharias, N., Dorland, B., Bredthauer, R., Boggs, K., Bredthauer, G., & Lesser, M. P. (2007). Realization and application of a 111 million pixel backside-illuminated detector and camera. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 6690). [669008] https://doi.org/10.1117/12.736961

Realization and application of a 111 million pixel backside-illuminated detector and camera. / Zacharias, Norbert; Dorland, Bryan; Bredthauer, Richard; Boggs, Kasey; Bredthauer, Greg; Lesser, Michael P.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6690 2007. 669008.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zacharias, N, Dorland, B, Bredthauer, R, Boggs, K, Bredthauer, G & Lesser, MP 2007, Realization and application of a 111 million pixel backside-illuminated detector and camera. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 6690, 669008, Focal Plane Arrays for Space Telescopes III, San Diego, CA, United States, 8/27/07. https://doi.org/10.1117/12.736961
Zacharias N, Dorland B, Bredthauer R, Boggs K, Bredthauer G, Lesser MP. Realization and application of a 111 million pixel backside-illuminated detector and camera. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6690. 2007. 669008 https://doi.org/10.1117/12.736961
Zacharias, Norbert ; Dorland, Bryan ; Bredthauer, Richard ; Boggs, Kasey ; Bredthauer, Greg ; Lesser, Michael P. / Realization and application of a 111 million pixel backside-illuminated detector and camera. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6690 2007.
@inproceedings{67efb9afd02240759164a9f4060808f1,
title = "Realization and application of a 111 million pixel backside-illuminated detector and camera",
abstract = "A full-wafer, 10,580 × 10,560 pixel (95 × 95 mm) CCD was designed and tested at Semiconductor Technology Associates (STA) with 9 μm. square pixels and 16 outputs. The chip was successfully fabricated in 2006 at DALSA and some performance results are presented here. This program was funded by the Office of Naval Research through a Small Business Innovation in Research (SBIR) program requested by the U.S. Naval Observatory for its next generation astrometric sky survey programs. Using Leach electronics, low read-noise output of the 111 million pixels requires 16 seconds at 0.9 MHz. Alternative electronics developed at STA allow readout at 20 MHz. Some modifications of the design to include anti-blooming features, a larger number of outputs, and use of p-channel material for space applications are discussed.",
keywords = "All-sky-survey, Astrometry, Large-format CCD, Space situational awareness, Star tracker",
author = "Norbert Zacharias and Bryan Dorland and Richard Bredthauer and Kasey Boggs and Greg Bredthauer and Lesser, {Michael P}",
year = "2007",
doi = "10.1117/12.736961",
language = "English (US)",
isbn = "9780819468383",
volume = "6690",
booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",

}

TY - GEN

T1 - Realization and application of a 111 million pixel backside-illuminated detector and camera

AU - Zacharias, Norbert

AU - Dorland, Bryan

AU - Bredthauer, Richard

AU - Boggs, Kasey

AU - Bredthauer, Greg

AU - Lesser, Michael P

PY - 2007

Y1 - 2007

N2 - A full-wafer, 10,580 × 10,560 pixel (95 × 95 mm) CCD was designed and tested at Semiconductor Technology Associates (STA) with 9 μm. square pixels and 16 outputs. The chip was successfully fabricated in 2006 at DALSA and some performance results are presented here. This program was funded by the Office of Naval Research through a Small Business Innovation in Research (SBIR) program requested by the U.S. Naval Observatory for its next generation astrometric sky survey programs. Using Leach electronics, low read-noise output of the 111 million pixels requires 16 seconds at 0.9 MHz. Alternative electronics developed at STA allow readout at 20 MHz. Some modifications of the design to include anti-blooming features, a larger number of outputs, and use of p-channel material for space applications are discussed.

AB - A full-wafer, 10,580 × 10,560 pixel (95 × 95 mm) CCD was designed and tested at Semiconductor Technology Associates (STA) with 9 μm. square pixels and 16 outputs. The chip was successfully fabricated in 2006 at DALSA and some performance results are presented here. This program was funded by the Office of Naval Research through a Small Business Innovation in Research (SBIR) program requested by the U.S. Naval Observatory for its next generation astrometric sky survey programs. Using Leach electronics, low read-noise output of the 111 million pixels requires 16 seconds at 0.9 MHz. Alternative electronics developed at STA allow readout at 20 MHz. Some modifications of the design to include anti-blooming features, a larger number of outputs, and use of p-channel material for space applications are discussed.

KW - All-sky-survey

KW - Astrometry

KW - Large-format CCD

KW - Space situational awareness

KW - Star tracker

UR - http://www.scopus.com/inward/record.url?scp=42249088743&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=42249088743&partnerID=8YFLogxK

U2 - 10.1117/12.736961

DO - 10.1117/12.736961

M3 - Conference contribution

AN - SCOPUS:42249088743

SN - 9780819468383

VL - 6690

BT - Proceedings of SPIE - The International Society for Optical Engineering

ER -