Recent research efforts aimed at optimizing charge-coupled devices (CCDs) after their manufacture to achieve maximum quantum efficiency, wide spectral bandpass, and excellent cosmetics and surface flatness are discussed. We present results of a new acid thinning agitation technique which produces very uniform, high quality surfaces on large area square and rectangular CCDs and 4' silicon wafers for back illuminated operation. In particular we present thinning results of Ford Aerospace 2048×2048 pixel CCDs. A method of cleaning thinned CCDs before antireflection coating for increased QE is also discussed. The results of initial experiments with a new packaging method to mount thinned CCDs while maintaining a very flat imaging surface are presented. This bump bonding mounting technique increases yield due to reduced handling and robust packaging and is expandable to tightly packed large area focal plane mosaics.