Recent charge-coupled device optimization results at steward observatory

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Recent research efforts aimed at optimizing charge-coupled devices (CCDs) after their manufacture to achieve maximum quantum efficiency, wide spectral bandpass, and excellent cosmetics and surface flatness are discussed. We present results of a new acid thinning agitation technique which produces very uniform, high quality surfaces on large area square and rectangular CCDs and 4' silicon wafers for back illuminated operation. In particular we present thinning results of Ford Aerospace 2048×2048 pixel CCDs. A method of cleaning thinned CCDs before antireflection coating for increased QE is also discussed. The results of initial experiments with a new packaging method to mount thinned CCDs while maintaining a very flat imaging surface are presented. This bump bonding mounting technique increases yield due to reduced handling and robust packaging and is expandable to tightly packed large area focal plane mosaics.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsMorley M. Blouke
PublisherPubl by Int Soc for Optical Engineering
Pages164-169
Number of pages6
Volume1242
ISBN (Print)0819402893
StatePublished - 1990
EventCharge-Coupled Devices and Solid State Optical Sensors - Santa Clara, CA, USA
Duration: Feb 12 1990Feb 14 1990

Other

OtherCharge-Coupled Devices and Solid State Optical Sensors
CitySanta Clara, CA, USA
Period2/12/902/14/90

Fingerprint

Observatories
Charge coupled devices
charge coupled devices
observatories
optimization
packaging
Packaging
Antireflection coatings
agitation
Cosmetics
antireflection coatings
flatness
mounting
Mountings
Quantum efficiency
Silicon wafers
cleaning
Surface properties
quantum efficiency
Cleaning

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Lesser, M. P. (1990). Recent charge-coupled device optimization results at steward observatory. In M. M. Blouke (Ed.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 1242, pp. 164-169). Publ by Int Soc for Optical Engineering.

Recent charge-coupled device optimization results at steward observatory. / Lesser, Michael P.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / Morley M. Blouke. Vol. 1242 Publ by Int Soc for Optical Engineering, 1990. p. 164-169.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lesser, MP 1990, Recent charge-coupled device optimization results at steward observatory. in MM Blouke (ed.), Proceedings of SPIE - The International Society for Optical Engineering. vol. 1242, Publ by Int Soc for Optical Engineering, pp. 164-169, Charge-Coupled Devices and Solid State Optical Sensors, Santa Clara, CA, USA, 2/12/90.
Lesser MP. Recent charge-coupled device optimization results at steward observatory. In Blouke MM, editor, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 1242. Publ by Int Soc for Optical Engineering. 1990. p. 164-169
Lesser, Michael P. / Recent charge-coupled device optimization results at steward observatory. Proceedings of SPIE - The International Society for Optical Engineering. editor / Morley M. Blouke. Vol. 1242 Publ by Int Soc for Optical Engineering, 1990. pp. 164-169
@inproceedings{4a156b026f454dbdba3e803ccad4838c,
title = "Recent charge-coupled device optimization results at steward observatory",
abstract = "Recent research efforts aimed at optimizing charge-coupled devices (CCDs) after their manufacture to achieve maximum quantum efficiency, wide spectral bandpass, and excellent cosmetics and surface flatness are discussed. We present results of a new acid thinning agitation technique which produces very uniform, high quality surfaces on large area square and rectangular CCDs and 4' silicon wafers for back illuminated operation. In particular we present thinning results of Ford Aerospace 2048×2048 pixel CCDs. A method of cleaning thinned CCDs before antireflection coating for increased QE is also discussed. The results of initial experiments with a new packaging method to mount thinned CCDs while maintaining a very flat imaging surface are presented. This bump bonding mounting technique increases yield due to reduced handling and robust packaging and is expandable to tightly packed large area focal plane mosaics.",
author = "Lesser, {Michael P}",
year = "1990",
language = "English (US)",
isbn = "0819402893",
volume = "1242",
pages = "164--169",
editor = "Blouke, {Morley M.}",
booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "Publ by Int Soc for Optical Engineering",

}

TY - GEN

T1 - Recent charge-coupled device optimization results at steward observatory

AU - Lesser, Michael P

PY - 1990

Y1 - 1990

N2 - Recent research efforts aimed at optimizing charge-coupled devices (CCDs) after their manufacture to achieve maximum quantum efficiency, wide spectral bandpass, and excellent cosmetics and surface flatness are discussed. We present results of a new acid thinning agitation technique which produces very uniform, high quality surfaces on large area square and rectangular CCDs and 4' silicon wafers for back illuminated operation. In particular we present thinning results of Ford Aerospace 2048×2048 pixel CCDs. A method of cleaning thinned CCDs before antireflection coating for increased QE is also discussed. The results of initial experiments with a new packaging method to mount thinned CCDs while maintaining a very flat imaging surface are presented. This bump bonding mounting technique increases yield due to reduced handling and robust packaging and is expandable to tightly packed large area focal plane mosaics.

AB - Recent research efforts aimed at optimizing charge-coupled devices (CCDs) after their manufacture to achieve maximum quantum efficiency, wide spectral bandpass, and excellent cosmetics and surface flatness are discussed. We present results of a new acid thinning agitation technique which produces very uniform, high quality surfaces on large area square and rectangular CCDs and 4' silicon wafers for back illuminated operation. In particular we present thinning results of Ford Aerospace 2048×2048 pixel CCDs. A method of cleaning thinned CCDs before antireflection coating for increased QE is also discussed. The results of initial experiments with a new packaging method to mount thinned CCDs while maintaining a very flat imaging surface are presented. This bump bonding mounting technique increases yield due to reduced handling and robust packaging and is expandable to tightly packed large area focal plane mosaics.

UR - http://www.scopus.com/inward/record.url?scp=0025591152&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025591152&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0025591152

SN - 0819402893

VL - 1242

SP - 164

EP - 169

BT - Proceedings of SPIE - The International Society for Optical Engineering

A2 - Blouke, Morley M.

PB - Publ by Int Soc for Optical Engineering

ER -