Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Hamoon Azizsoltani, Achintya Haldar

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of nonlinearities are incorporated as realistically as practicable. Uncertainties in all design variables are quantified using available information. The thermomechanical loading is represented by five design parameters and uncertainties associated with them are incorporated. Since the performance or limit state function (LSF) of such complicated problem is implicit in nature, it is approximately generated explicitly in the failure region with the help of a completely improved response surface method (RSM)-based approach and the universal Kriging method (KM). The response surface (RS) is generated by conducting as few deterministic nonlinear finite element analyses as possible by integrating several advanced factorial mathematical concepts producing compounding beneficial effect. The accuracy, efficiency, and application potential of the procedure are established with the help of Monte Carlo simulation (MCS) and the results from laboratory investigation reported in the literature. The study conclusively verified the proposed method. Similar studies can be conducted to fill the knowledge gap for cases where the available analytical and experimental studies are limited or extend the information to cases where reliability information is unavailable. The study showcased how reliability information can be extracted with the help of multiple deterministic analyses. The authors believe that they proposed an alternative to the classical MCS technique.

Original languageEnglish (US)
Article number041003
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume140
Issue number4
DOIs
StatePublished - Dec 1 2018

Fingerprint

Electronics packaging
Reliability analysis
Soldering alloys
Lead-free solders
Monte Carlo simulation
Uncertainty

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

@article{2c5e4ba4749344eb9d4f26b0e37ba2ac,
title = "Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept",
abstract = "A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of nonlinearities are incorporated as realistically as practicable. Uncertainties in all design variables are quantified using available information. The thermomechanical loading is represented by five design parameters and uncertainties associated with them are incorporated. Since the performance or limit state function (LSF) of such complicated problem is implicit in nature, it is approximately generated explicitly in the failure region with the help of a completely improved response surface method (RSM)-based approach and the universal Kriging method (KM). The response surface (RS) is generated by conducting as few deterministic nonlinear finite element analyses as possible by integrating several advanced factorial mathematical concepts producing compounding beneficial effect. The accuracy, efficiency, and application potential of the procedure are established with the help of Monte Carlo simulation (MCS) and the results from laboratory investigation reported in the literature. The study conclusively verified the proposed method. Similar studies can be conducted to fill the knowledge gap for cases where the available analytical and experimental studies are limited or extend the information to cases where reliability information is unavailable. The study showcased how reliability information can be extracted with the help of multiple deterministic analyses. The authors believe that they proposed an alternative to the classical MCS technique.",
author = "Hamoon Azizsoltani and Achintya Haldar",
year = "2018",
month = "12",
day = "1",
doi = "10.1115/1.4040924",
language = "English (US)",
volume = "140",
journal = "Journal of Electronic Packaging, Transactions of the ASME",
issn = "1043-7398",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "4",

}

TY - JOUR

T1 - Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

AU - Azizsoltani, Hamoon

AU - Haldar, Achintya

PY - 2018/12/1

Y1 - 2018/12/1

N2 - A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of nonlinearities are incorporated as realistically as practicable. Uncertainties in all design variables are quantified using available information. The thermomechanical loading is represented by five design parameters and uncertainties associated with them are incorporated. Since the performance or limit state function (LSF) of such complicated problem is implicit in nature, it is approximately generated explicitly in the failure region with the help of a completely improved response surface method (RSM)-based approach and the universal Kriging method (KM). The response surface (RS) is generated by conducting as few deterministic nonlinear finite element analyses as possible by integrating several advanced factorial mathematical concepts producing compounding beneficial effect. The accuracy, efficiency, and application potential of the procedure are established with the help of Monte Carlo simulation (MCS) and the results from laboratory investigation reported in the literature. The study conclusively verified the proposed method. Similar studies can be conducted to fill the knowledge gap for cases where the available analytical and experimental studies are limited or extend the information to cases where reliability information is unavailable. The study showcased how reliability information can be extracted with the help of multiple deterministic analyses. The authors believe that they proposed an alternative to the classical MCS technique.

AB - A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of nonlinearities are incorporated as realistically as practicable. Uncertainties in all design variables are quantified using available information. The thermomechanical loading is represented by five design parameters and uncertainties associated with them are incorporated. Since the performance or limit state function (LSF) of such complicated problem is implicit in nature, it is approximately generated explicitly in the failure region with the help of a completely improved response surface method (RSM)-based approach and the universal Kriging method (KM). The response surface (RS) is generated by conducting as few deterministic nonlinear finite element analyses as possible by integrating several advanced factorial mathematical concepts producing compounding beneficial effect. The accuracy, efficiency, and application potential of the procedure are established with the help of Monte Carlo simulation (MCS) and the results from laboratory investigation reported in the literature. The study conclusively verified the proposed method. Similar studies can be conducted to fill the knowledge gap for cases where the available analytical and experimental studies are limited or extend the information to cases where reliability information is unavailable. The study showcased how reliability information can be extracted with the help of multiple deterministic analyses. The authors believe that they proposed an alternative to the classical MCS technique.

UR - http://www.scopus.com/inward/record.url?scp=85052373532&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85052373532&partnerID=8YFLogxK

U2 - 10.1115/1.4040924

DO - 10.1115/1.4040924

M3 - Article

VL - 140

JO - Journal of Electronic Packaging, Transactions of the ASME

JF - Journal of Electronic Packaging, Transactions of the ASME

SN - 1043-7398

IS - 4

M1 - 041003

ER -