Repair of porous methyl-substituted silicon dioxide films using supercritical CO 2

Research output: Contribution to journalConference articlepeer-review


The repair of porous methyl-substituted silicon dioxide films after plasma processing was investigated using hexamethyldisilazane (HMDS) dissolved in liquid and supercritical carbon dioxide. The films were cured, blanket methylsilsesquioxane (MSQ) layers (JSR LKD 5109). An ashed film treated with a HMDS/supercritical carbon dioxide (scCO 2) mixture was stable for thirty days without readsorbing moisture from the ambient as shown by both Fourier transform infrared (FTIK) spectroscopy and contact angle measurements, whereas a film annealed to 360°C in nitrogen for 2 min readsorbed moisture quickly over 10 days. The film thickness increased by 2-5 nm and the surfaces were Hydrophobic after processing with HMDS. The dielectric constant of metal-insulator-semiconductor capacitors was 2.89 ± 0.08 in 1 vol% HMDS/liquid CO 2, 2.55 ± 0.07 in 1 vol% HMDS/scCO 2, and 2.57 ± 0.06 in pure liquid HMDS, demonstrating partial or complete repair after plasma ashing. Processing with supercritical CO 2 yielded the best performance based on resistance to moisture readsorption, contact angle, dielectric constant, resource consumption, and processing time.

Original languageEnglish (US)
Pages (from-to)293-300
Number of pages8
JournalECS Transactions
Issue number3
StatePublished - Dec 1 2005
Event9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society - Los Angeles, CA, United States
Duration: Oct 16 2005Oct 21 2005

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Repair of porous methyl-substituted silicon dioxide films using supercritical CO <sub>2</sub>'. Together they form a unique fingerprint.

Cite this