A finite element analysis is used in conjunction with failure models for fatigue-life prediction of electronic packages. One of the widely accepted models for predicting the fatigue life of a solder joint is based on the volume-weighted average plastic work density. This model, introduced by Darveaux, utilizes experimental measurements at the package level and relies on the specific values of certain parameters. These parameters were determined through curve-fitting against measurements in conjunction with the finite element simulations using an earlier version of the ANSYS finite element program. However, it was discovered by Anderson et al. that the previous version of ANSYS computed an incorrect plastic work density, whose value is critical in the determination of these parameters. Therefore, these parameters have been recalculated by Darveaux using the corrected version of ANSYS. This study investigates the effect of the previous and recent values of these parameters on solder-joint life prediction by considering six different package types provided by leading companies in the electronics industry. The dimensions and material properties, as well as the measured life, of each package were obtained directly from industry.
|Original language||English (US)|
|Number of pages||6|
|Journal||Proceedings - Electronic Components and Technology Conference|
|State||Published - Dec 1 2000|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering