Screening study on frictional force analysis in relation to silica abrasive and slurry properties

Yun Zhuang, Yasa Adi Sampurno, Fransisca Sudargho, Geoff Steward, Herbert Barthel, Erwin Peter Mayer, Torsten Gottschalk-Gaudig, Michael Stintz, Uwe Kaetzel, Andre Nogowski, Michael Goldstein, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, different amounts of standard fumed silica and fumed silica contaminated by coarse particles was added as powder to a standard copper CMP slurry to investigate their effects on large particle count, mean particle size, slurry viscosity, frictional force during wafer polishing, and copper removal rate. Standard silica powder consisted of the same particles used in the standard slurry while contaminated silica powder consisted of the same particles used in the standard slurry and additional large size particles. Large particle count analysis indicated that slurry dispersion itself generated large size particles in the slurries. The addition of 0.3% and 1% contaminated silica to the standard slurry caused significant increases in large particle count, and the mean particle size increased with the amount of contaminated silica added to the standard slurry. The slurry viscosity generally increased with the amount of standard and contaminated silica added to the standard slurry under the shear rate of 100 s-1. The standard slurry and slurries added with 0.3% and 1% contaminated silica were used to polish 200-mm blanket copper wafers on the APD-500 polisher that has the unique ability to measure frictional force in real time during polishing. The coefficient of friction increased with the amount of contaminated silica added to the standard slurry. In general, the removal rates for the slurry added with 1% contaminated silica were higher than the standard slurry and slurry added with 0.3% contaminated silica.

Original languageEnglish (US)
Title of host publication2007 MRS Spring Meeting
Pages233-238
Number of pages6
StatePublished - Dec 1 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 9 2007Apr 13 2007

Publication series

NameMaterials Research Society Symposium Proceedings
Volume991
ISSN (Print)0272-9172

Other

Other2007 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period4/9/074/13/07

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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