Simulation of board-level free-space optical interconnects for electronic processing

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

A simulation program for evaluating free-space optical interconnects at the board system level is described. The algorithm combines the interactive effects of component misalignment, beam expansion, propagation distance, and optical cross talk on system-bit error rate and packing density. The program is used to evaluate the conditions that are necessary for a board-level system to achieve a bit error rate of 10-17 with maximum signal-packing density for a source receiver separation of 10 cm and an alignment tolerance of ±0.27 deg. The design example incorporates substrate-mode holographic optical elements for lateral and longitudinal signal distribution.

Original languageEnglish (US)
Pages (from-to)2438-2445
Number of pages8
JournalApplied Optics
Volume31
Issue number14
DOIs
StatePublished - May 10 1992

Fingerprint

free-space optical interconnects
Optical interconnects
packing density
bit error rate
Bit error rate
Holographic optical elements
holographic optical elements
Processing
electronics
misalignment
simulation
receivers
alignment
expansion
propagation
Substrates

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Simulation of board-level free-space optical interconnects for electronic processing. / Kostuk, Raymond K.

In: Applied Optics, Vol. 31, No. 14, 10.05.1992, p. 2438-2445.

Research output: Contribution to journalArticle

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