Slurry-induced pad wear rate in chemical mechanical planarization

Anand Meled, Yasa Sampurno, Yun Zhuang, Ara Philipossian

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

In this study, the extent of the pad wear rate during the shallow trench isolation chemical mechanical planarization process was investigated for several combinations of the type of abrasive particles (i.e., colloidal and fumed silica), abrasive content, and abrasive concentration. Results showed a relation between pad wear rate and abrasive concentration for both fumed and colloidal slurries. Results indicated that the pad wear rate using the colloidal silica slurry was higher by approximately 42 and 6% at 3 and 25 wt % silica, respectively. Under the same abrasive content, pad wear rate for fumed slurry was 23% higher compared to colloidal slurry.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Volume13
Issue number3
DOIs
StatePublished - 2010

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Chemical mechanical polishing
abrasives
Abrasives
Wear of materials
Silicon Dioxide
Silica
silicon dioxide
slurries
Slurries
isolation

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Cite this

Slurry-induced pad wear rate in chemical mechanical planarization. / Meled, Anand; Sampurno, Yasa; Zhuang, Yun; Philipossian, Ara.

In: Electrochemical and Solid-State Letters, Vol. 13, No. 3, 2010.

Research output: Contribution to journalArticle

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