Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Ara Philipossian, Erin Mitchell

Research output: Contribution to journalArticle

41 Citations (Scopus)

Abstract

The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the chemical mechanical planarization (CMP) process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22%, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

Original languageEnglish (US)
Pages (from-to)7259-7264
Number of pages6
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume42
Issue number12
StatePublished - Dec 2003

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Chemical mechanical polishing
Residence time distribution
wafers
Textures
Flow rate
grooving
textures
flow velocity

Keywords

  • Chemical mechanical planarization (CMP) slurry utilization efficiency mean residence time coefficient of friction (COF) slurry flow rate pad surface texture

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

@article{6d512a551675489eb30b857aa96ca691,
title = "Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization",
abstract = "The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the chemical mechanical planarization (CMP) process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22{\%}, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).",
keywords = "Chemical mechanical planarization (CMP) slurry utilization efficiency mean residence time coefficient of friction (COF) slurry flow rate pad surface texture",
author = "Ara Philipossian and Erin Mitchell",
year = "2003",
month = "12",
language = "English (US)",
volume = "42",
pages = "7259--7264",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",
number = "12",

}

TY - JOUR

T1 - Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

AU - Philipossian, Ara

AU - Mitchell, Erin

PY - 2003/12

Y1 - 2003/12

N2 - The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the chemical mechanical planarization (CMP) process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22%, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

AB - The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the chemical mechanical planarization (CMP) process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22%, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

KW - Chemical mechanical planarization (CMP) slurry utilization efficiency mean residence time coefficient of friction (COF) slurry flow rate pad surface texture

UR - http://www.scopus.com/inward/record.url?scp=1242265322&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=1242265322&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:1242265322

VL - 42

SP - 7259

EP - 7264

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 12

ER -