Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Ara Philipossian, Erin Mitchell

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (ν) of the CMP process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that ν ranges from 2 to 22 percent, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsD.S. Boning, K. Devriendt, M.R. Oliver, D.J. Stein, I. Vos
Pages21-26
Number of pages6
Volume767
StatePublished - 2003
EventChemical-Mechanical Planarization - San Francisco, CA, United States
Duration: Apr 22 2003Apr 24 2003

Other

OtherChemical-Mechanical Planarization
CountryUnited States
CitySan Francisco, CA
Period4/22/034/24/03

Fingerprint

Chemical mechanical polishing
Cytidine Monophosphate
Industrial Oils
Residence time distribution
Textures
Flow rate

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Philipossian, A., & Mitchell, E. (2003). Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization. In D. S. Boning, K. Devriendt, M. R. Oliver, D. J. Stein, & I. Vos (Eds.), Materials Research Society Symposium - Proceedings (Vol. 767, pp. 21-26)

Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization. / Philipossian, Ara; Mitchell, Erin.

Materials Research Society Symposium - Proceedings. ed. / D.S. Boning; K. Devriendt; M.R. Oliver; D.J. Stein; I. Vos. Vol. 767 2003. p. 21-26.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Philipossian, A & Mitchell, E 2003, Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization. in DS Boning, K Devriendt, MR Oliver, DJ Stein & I Vos (eds), Materials Research Society Symposium - Proceedings. vol. 767, pp. 21-26, Chemical-Mechanical Planarization, San Francisco, CA, United States, 4/22/03.
Philipossian A, Mitchell E. Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization. In Boning DS, Devriendt K, Oliver MR, Stein DJ, Vos I, editors, Materials Research Society Symposium - Proceedings. Vol. 767. 2003. p. 21-26
Philipossian, Ara ; Mitchell, Erin. / Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization. Materials Research Society Symposium - Proceedings. editor / D.S. Boning ; K. Devriendt ; M.R. Oliver ; D.J. Stein ; I. Vos. Vol. 767 2003. pp. 21-26
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