Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Ara Philipossian, Erin Mitchell

Research output: Contribution to journalConference article

Abstract

The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (ν) of the CMP process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that ν ranges from 2 to 22 percent, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

Original languageEnglish (US)
Pages (from-to)21-26
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume767
StatePublished - Nov 10 2003
EventChemical-Mechanical Planarization - San Francisco, CA, United States
Duration: Apr 22 2003Apr 24 2003

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ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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