Solder joint life prediction model based on the strain energy density criterion

I. Guven, V. Kradinov, Erdogan Madenci, J. L. Tor

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages214-220
Number of pages7
Publication statusPublished - 2003
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: May 27 2003May 30 2003

Other

Other53rd Electronic Components and Technology Conference 2003
CountryUnited States
CityNew Orleans LA
Period5/27/035/30/03

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Guven, I., Kradinov, V., Madenci, E., & Tor, J. L. (2003). Solder joint life prediction model based on the strain energy density criterion. In Proceedings - Electronic Components and Technology Conference (pp. 214-220)