Solder joint life prediction model based on the strain energy density criterion

I. Guven, V. Kradinov, Erdogan Madenci, J. L. Tor

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages214-220
Number of pages7
StatePublished - 2003
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: May 27 2003May 30 2003

Other

Other53rd Electronic Components and Technology Conference 2003
CountryUnited States
CityNew Orleans LA
Period5/27/035/30/03

Fingerprint

Strain energy
Soldering alloys
Crack propagation
Thermal cycling

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Guven, I., Kradinov, V., Madenci, E., & Tor, J. L. (2003). Solder joint life prediction model based on the strain energy density criterion. In Proceedings - Electronic Components and Technology Conference (pp. 214-220)

Solder joint life prediction model based on the strain energy density criterion. / Guven, I.; Kradinov, V.; Madenci, Erdogan; Tor, J. L.

Proceedings - Electronic Components and Technology Conference. 2003. p. 214-220.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Guven, I, Kradinov, V, Madenci, E & Tor, JL 2003, Solder joint life prediction model based on the strain energy density criterion. in Proceedings - Electronic Components and Technology Conference. pp. 214-220, 53rd Electronic Components and Technology Conference 2003, New Orleans LA, United States, 5/27/03.
Guven I, Kradinov V, Madenci E, Tor JL. Solder joint life prediction model based on the strain energy density criterion. In Proceedings - Electronic Components and Technology Conference. 2003. p. 214-220
Guven, I. ; Kradinov, V. ; Madenci, Erdogan ; Tor, J. L. / Solder joint life prediction model based on the strain energy density criterion. Proceedings - Electronic Components and Technology Conference. 2003. pp. 214-220
@inproceedings{45c1dc45a91a4acabc1c585a860f7dd4,
title = "Solder joint life prediction model based on the strain energy density criterion",
abstract = "This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.",
author = "I. Guven and V. Kradinov and Erdogan Madenci and Tor, {J. L.}",
year = "2003",
language = "English (US)",
pages = "214--220",
booktitle = "Proceedings - Electronic Components and Technology Conference",

}

TY - GEN

T1 - Solder joint life prediction model based on the strain energy density criterion

AU - Guven, I.

AU - Kradinov, V.

AU - Madenci, Erdogan

AU - Tor, J. L.

PY - 2003

Y1 - 2003

N2 - This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.

AB - This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.

UR - http://www.scopus.com/inward/record.url?scp=0038012877&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038012877&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0038012877

SP - 214

EP - 220

BT - Proceedings - Electronic Components and Technology Conference

ER -