Stochastic interconnect modeling and transient simulation in the presence of process variations

Ying Zhang, Janet M. Wang, Liang Xiao, Huizhong Wu

Research output: Contribution to conferencePaper

Abstract

The random process variations are always existent during manufacturing process, which has a definite impact on transmission performance of interconnects. Considering the impact the stochastic interconnect model is proposed, and the statistical analysis of the transient simulation, which is based on Monte Carlo method, is presented. During the analytical process the method on lines is applied to solve the transient simulation of each sample, and Jarque-Bera test is made to verify the normality of the output. Finally the worst-case estimation is given. Experimental results demonstrate that the proposed stochastic model and the corresponding statistical analysis method can evaluate the transmission performance of interconnects effectively, which is very significant for the control and optimization of interconnects' manufacturing process.

Original languageEnglish (US)
Pages1134-1138
Number of pages5
StatePublished - Jan 1 2005
EventAsian Simulation Conference 2005, ASC 2005 and the 6th International Conference on System Simulation and Scientific Computing, ICSC 2005 - Beijing, China
Duration: Oct 24 2005Oct 27 2005

Other

OtherAsian Simulation Conference 2005, ASC 2005 and the 6th International Conference on System Simulation and Scientific Computing, ICSC 2005
CountryChina
CityBeijing
Period10/24/0510/27/05

Keywords

  • Monte Carlo Method
  • Process variations
  • Stochastic modeling
  • Transient simulation

ASJC Scopus subject areas

  • Software

Fingerprint Dive into the research topics of 'Stochastic interconnect modeling and transient simulation in the presence of process variations'. Together they form a unique fingerprint.

  • Cite this

    Zhang, Y., Wang, J. M., Xiao, L., & Wu, H. (2005). Stochastic interconnect modeling and transient simulation in the presence of process variations. 1134-1138. Paper presented at Asian Simulation Conference 2005, ASC 2005 and the 6th International Conference on System Simulation and Scientific Computing, ICSC 2005, Beijing, China.