Strain energy density criterion for reliability life prediction of solder joints in electronic packaging

I. Guven, V. Kradinov, J. L. Tor, E. Madenci

Research output: Contribution to journalArticle

12 Scopus citations

Abstract

This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.

Original languageEnglish (US)
Pages (from-to)398-405
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume126
Issue number3
DOIs
StatePublished - Sep 1 2004

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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