Stress concentrations in electronic packaging

Ravi Mahajan, Erdogan Madenci, Levent Ileri, Mark Thurston

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The reliability of ceramic and plastic packages used in microelectronics is compromised by interface (delamination) and homogeneous (bulk) cracking that is initiated during processing and stress testing. These crackling failures have certain characteristics in that they begin at locations of geometric stress concentrations and propagate along typical failure paths. Characterization of these stress concentrations is therefore essential to a good design and for defining material response parameters such as bulk and interfacial fracture toughness. In this paper, applications of a general-purpose finite element technique for the characterization of stress concentrations are presented. The technique uses the full two-dimensional elasticity solution for different materials that are bonded together. It is possible to use this technique to extract relevant material parameters, such as stress intensity factors, the J-integral, or energy release rate, and hence to eventually define the conditions necessary for crack initiation and propagation.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsC.Robert Sundahl, King-Ning Tu, A.Kenneth Jackson, Peter Borgesen
PublisherMaterials Research Society
Pages39-48
Number of pages10
Volume390
StatePublished - 1995
Externally publishedYes
EventProceedings of the Spring Meeting on MRS - San Francisco, CA, USA
Duration: Apr 17 1995Apr 20 1995

Other

OtherProceedings of the Spring Meeting on MRS
CitySan Francisco, CA, USA
Period4/17/954/20/95

Fingerprint

Electronics packaging
Stress concentration
Energy release rate
Crack initiation
Delamination
Microelectronics
Stress intensity factors
Fracture toughness
Elasticity
Crack propagation
Plastics
Testing
Processing

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Mahajan, R., Madenci, E., Ileri, L., & Thurston, M. (1995). Stress concentrations in electronic packaging. In C. R. Sundahl, K-N. Tu, A. K. Jackson, & P. Borgesen (Eds.), Materials Research Society Symposium - Proceedings (Vol. 390, pp. 39-48). Materials Research Society.

Stress concentrations in electronic packaging. / Mahajan, Ravi; Madenci, Erdogan; Ileri, Levent; Thurston, Mark.

Materials Research Society Symposium - Proceedings. ed. / C.Robert Sundahl; King-Ning Tu; A.Kenneth Jackson; Peter Borgesen. Vol. 390 Materials Research Society, 1995. p. 39-48.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mahajan, R, Madenci, E, Ileri, L & Thurston, M 1995, Stress concentrations in electronic packaging. in CR Sundahl, K-N Tu, AK Jackson & P Borgesen (eds), Materials Research Society Symposium - Proceedings. vol. 390, Materials Research Society, pp. 39-48, Proceedings of the Spring Meeting on MRS, San Francisco, CA, USA, 4/17/95.
Mahajan R, Madenci E, Ileri L, Thurston M. Stress concentrations in electronic packaging. In Sundahl CR, Tu K-N, Jackson AK, Borgesen P, editors, Materials Research Society Symposium - Proceedings. Vol. 390. Materials Research Society. 1995. p. 39-48
Mahajan, Ravi ; Madenci, Erdogan ; Ileri, Levent ; Thurston, Mark. / Stress concentrations in electronic packaging. Materials Research Society Symposium - Proceedings. editor / C.Robert Sundahl ; King-Ning Tu ; A.Kenneth Jackson ; Peter Borgesen. Vol. 390 Materials Research Society, 1995. pp. 39-48
@inproceedings{7eec826438444b8b8edf5819b15fd13b,
title = "Stress concentrations in electronic packaging",
abstract = "The reliability of ceramic and plastic packages used in microelectronics is compromised by interface (delamination) and homogeneous (bulk) cracking that is initiated during processing and stress testing. These crackling failures have certain characteristics in that they begin at locations of geometric stress concentrations and propagate along typical failure paths. Characterization of these stress concentrations is therefore essential to a good design and for defining material response parameters such as bulk and interfacial fracture toughness. In this paper, applications of a general-purpose finite element technique for the characterization of stress concentrations are presented. The technique uses the full two-dimensional elasticity solution for different materials that are bonded together. It is possible to use this technique to extract relevant material parameters, such as stress intensity factors, the J-integral, or energy release rate, and hence to eventually define the conditions necessary for crack initiation and propagation.",
author = "Ravi Mahajan and Erdogan Madenci and Levent Ileri and Mark Thurston",
year = "1995",
language = "English (US)",
volume = "390",
pages = "39--48",
editor = "C.Robert Sundahl and King-Ning Tu and A.Kenneth Jackson and Peter Borgesen",
booktitle = "Materials Research Society Symposium - Proceedings",
publisher = "Materials Research Society",

}

TY - GEN

T1 - Stress concentrations in electronic packaging

AU - Mahajan, Ravi

AU - Madenci, Erdogan

AU - Ileri, Levent

AU - Thurston, Mark

PY - 1995

Y1 - 1995

N2 - The reliability of ceramic and plastic packages used in microelectronics is compromised by interface (delamination) and homogeneous (bulk) cracking that is initiated during processing and stress testing. These crackling failures have certain characteristics in that they begin at locations of geometric stress concentrations and propagate along typical failure paths. Characterization of these stress concentrations is therefore essential to a good design and for defining material response parameters such as bulk and interfacial fracture toughness. In this paper, applications of a general-purpose finite element technique for the characterization of stress concentrations are presented. The technique uses the full two-dimensional elasticity solution for different materials that are bonded together. It is possible to use this technique to extract relevant material parameters, such as stress intensity factors, the J-integral, or energy release rate, and hence to eventually define the conditions necessary for crack initiation and propagation.

AB - The reliability of ceramic and plastic packages used in microelectronics is compromised by interface (delamination) and homogeneous (bulk) cracking that is initiated during processing and stress testing. These crackling failures have certain characteristics in that they begin at locations of geometric stress concentrations and propagate along typical failure paths. Characterization of these stress concentrations is therefore essential to a good design and for defining material response parameters such as bulk and interfacial fracture toughness. In this paper, applications of a general-purpose finite element technique for the characterization of stress concentrations are presented. The technique uses the full two-dimensional elasticity solution for different materials that are bonded together. It is possible to use this technique to extract relevant material parameters, such as stress intensity factors, the J-integral, or energy release rate, and hence to eventually define the conditions necessary for crack initiation and propagation.

UR - http://www.scopus.com/inward/record.url?scp=0029179554&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029179554&partnerID=8YFLogxK

M3 - Conference contribution

VL - 390

SP - 39

EP - 48

BT - Materials Research Society Symposium - Proceedings

A2 - Sundahl, C.Robert

A2 - Tu, King-Ning

A2 - Jackson, A.Kenneth

A2 - Borgesen, Peter

PB - Materials Research Society

ER -